Effect of liquid–liquid structure transition on solidification and wettability of Sn–0.7Cu solder

Li, Yuanxing; Zhang, Fei; Zu, Fang‐Qiu; Lv, Xue-Chuan; Zhao, Zhenxing; Dongdong, Yang

doi:10.1016/j.jallcom.2010.06.087

Cited by 37 publications

(16 citation statements)

References 29 publications

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“…Among commercially available lead-free solders, Sn-0.7wt%Cu solder systems were widely used in wave soldering due to their availability and low cost [1,2].…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Salleh

McDonald

Gourlay

et al. 2015

Journal of Elec Materi

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This paper investigates the effect of 0.05 wt.% Ni on the formation and growth of primary Cu6Sn5 in Sn-0.7 wt.%Cu solder paste soldered on a Cu substrate, using a real-time synchrotron imaging technique. It was found that small additions of Ni significantly alter the formation and growth of the primary Cu6Sn5 intermetallics, making them small. In contrast, without Ni, primary Cu6Sn5 intermetallics tend to continue growth throughout solidification and end up much larger and coarser. The primary effect of the Ni addition appears to be in promoting the nucleation of a larger amount of small Cu6Sn5. The results provide direct evidence of the sequence of events in the reaction of Nicontaining Sn-0.7 wt.%Cu solder paste with a Cu substrate, and in particular the formation and growth of the primary Cu6Sn5 intermetallic 2

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“…Among commercially available lead-free solders, Sn-0.7wt%Cu solder systems were widely used in wave soldering due to their availability and low cost [1,2].…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Salleh

McDonald

Gourlay

et al. 2015

Journal of Elec Materi

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“…In our former works, by means of X-ray diffraction, we observed the occurrence of discontinuous structure changes in In-Sn melts directly [7]. In some other binary alloys, such as SnBi, SnCu alloys [20,12], such a change has also been found by the electrical resistivity method and DSC experiments. So we have reason to believe that the abrupt change in Fig.…”

Section: Resultsmentioning

confidence: 78%

“…PbSn, InSn, CuSn and SnBi [3][4][5][6][7]. Further works also reveal that the LLSC has significant impact on the solidification process and properties of alloys [8][9][10][11][12]. All of these studies promoted our knowledge about the nature of liquid structure and the correlation of liquid-solid.…”

Section: Introductionmentioning

confidence: 82%

Influence of melt overheating on microstructure and soldering properties of SnBiCu solder alloy

Chen¹,

Bao²,

Huang³

et al. 2016

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The melt structure transition behaviors of SnBi17Cu0.5 solder alloy were investigated in detail. By Differential Scanning Calorimetry (DSC) and electrical resistivity method, an anomalous change has been found in 835-875• C during heating process on the ρ-T and DSC curves. It reveals that a liquid-liquid structure change (LLSC) occurs in the melt. Through melt overheating treatment, the influence of LLSC on solidification process and material properties has been further studied: bigger solidification undercooling degree in the solidification process, finer and more dispersing solidification structure, and more importantly, the mechanical and welding properties of the solder alloy have also been obviously improved.K e y w o r d s : melt structure, liquid structure change, SnBi17Cu0.5 solder, soldering property, solidification

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“…The reflow soldering process influences various defects, such as the tombstone effect [1,2], void formation [3,4], the nonspread effect [5,6], flux spattering [7,8], dewetting [9], and whisker growth [10,11]. These defects are mainly attributed to poor compatibility between the materials used or a poorly chosen temperature profile.…”

Section: Introductionmentioning

confidence: 99%

“…The work of Chen et al [13] revealed the interfacial microstructures of both cases. Above Ni, there is a layer of the (Cu, Ni) 6 Sn 5 intermetallic compound. The thermal expansion characteristics of this intermetallic compound have been reported by Mu et al [14].…”

Section: Introductionmentioning

confidence: 99%

Influence of latent heat released from solder joints on the reflow temperature profile

Dusek

Rudajevová

Placek

2015

J Mater Sci: Mater Electron

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The reflow process of SAC305 solder paste was investigated by differential scanning calorimetry (DSC) and measurement of the temperature profiles in a real continual convection reflow furnace. Melting and solidification processes of two solder joints were investigated by both methods to determine the influence of latent heat on the surrounding temperature. While one peak was present during melting in DSC, two peaks were present during solidification of two joints connected by a resistor. The released latent heat from one joint increased the temperature of the surroundings and delayed the solidification process of the second joint. Analysis of the temperature profiles obtained during the reflow processes in a real furnace shows that latent heat influences the surrounding temperature not only during the phase transformation, but also during the whole following passage of the sample in the furnace. The maximum temperature increase of the joint is substantial: 25 mg of the solder paste increases the joint temperature by about 15°C. When two joints are placed on the sample the temperature increase is close to 20°C.

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Effect of liquid–liquid structure transition on solidification and wettability of Sn–0.7Cu solder

Cited by 37 publications

References 29 publications

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Influence of melt overheating on microstructure and soldering properties of SnBiCu solder alloy

Influence of latent heat released from solder joints on the reflow temperature profile

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