2005
DOI: 10.1111/j.1551-2916.2005.00212.x
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Effect of Liquid Phase Sintering on Microstructure and Mechanical Properties of Yb2O3‐AlN Containing SiC‐Based Ceramics

Abstract: A series of silicon carbide‐based ceramics with different sintering additives were liquid‐phase sintered to high densities. Yb2O3 in combination with AlN was used as the additive, instead of the commonly used Y2O3–AlN, to improve the refractoriness of the secondary phase. Thermo‐chemical decomposition of AlN was sufficiently suppressed with the use of nitrogen overpressure and reasonable weight loss was achieved in the different additive containing SiC ceramics without a reactive powder bed. Use of the heavier… Show more

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Cited by 45 publications
(50 citation statements)
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“…Thus, it was concluded that P 2 C can be used for the fabrication of nanocrystalline SiC samples with excellent hardness and fracture toughness. [34][35][36][37][38] are comparable to the values obtained for the SiC samples sintered in the P 2 C in the current work. Some of the processing conditions used are also given to show that SiC can be sintered in the P 2 C at much lower temperatures than reported in the literature for other processes such as gas-pressure-assisted sintering (GPS), pressureless sintering, and HP.…”
Section: Indentation Toughnesssupporting
confidence: 93%
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“…Thus, it was concluded that P 2 C can be used for the fabrication of nanocrystalline SiC samples with excellent hardness and fracture toughness. [34][35][36][37][38] are comparable to the values obtained for the SiC samples sintered in the P 2 C in the current work. Some of the processing conditions used are also given to show that SiC can be sintered in the P 2 C at much lower temperatures than reported in the literature for other processes such as gas-pressure-assisted sintering (GPS), pressureless sintering, and HP.…”
Section: Indentation Toughnesssupporting
confidence: 93%
“…These were similar to those reported in the literature for SiC prepared by various methods such as pressureless sintering and HP at much higher temperatures between 2073 K and 2273 K (1800°C and 2000°C). [34][35][36][37][38] A comparison of various literature studies with the current work is shown in Figure 13. The reduced time and temperature in the P 2 C process led to increased process efficiency.…”
Section: Microstructurementioning
confidence: 93%
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“…3. Among the investigated systems, the toughness was the lowest (3.54 MPa.m [8,20,24,25]. From the morphology of fracture surfaces, the absence of significant toughening mechanisms in SCSc caused it to have the lowest toughness.…”
Section: Resultsmentioning
confidence: 98%