Effect of Manufacturing Process Tolerances on MEMS Vibratory Sensor Dynamics

Abstract

In this paper, a solid disk resonator is designed for manufacturability inside a wafer-level sealed cavity with fusion-bonding process. The device is then simulated using finite element analysis with a variety of manufacturing process tolerances to determine the effect of these variations on the performance of the resonator. It is shown that radial offset of the resonator due to misalignment during bond strongly affects in altering the operating frequencies of the resonator. The design approach considering manufacturing tolerances presented in this paper can be beneficial for high precision MEMS inertial sensor development.