Effect of material removal state on the selection of theoretical models when scratching single-crystal copper using the load modulation approach

Abstract

This article presents a constant force–controlled cutting approach with two different geometries of cutting tools. The methodologies for establishing two theoretical models were proposed to quantitatively predict the required applied normal forces at the expected machined depths, which were obtained with a solution to the horizontal projection of the sample–tip contact area and the multi-edge form tip based on a generalized cutting approach, respectively. The selection of the proposed theoretical models is dependent on the two material removal states, respectively, in which one is plowing for a regular triangular pyramid and the other one is cutting chips for a single-point diamond tip. To verify the feasibility and effectiveness of the proposed theoretical models and cutting strategy, a constant normal force cutting of microgrooves was implemented on a single-crystal copper substrate, while realizing constant cutting depths. The difference between the setting normal forces and the theoretical normal forces was analyzed by comparing the experimental results and the model prediction results. The aim of the present study was to investigate the effect of the geometry of the cutting tools on the material removal state and on the selection of the theoretical models.

Fabrication of three-dimensional sin-shaped ripples using a multi-tip diamond tool based on the force modulation approach

“…Figure 1 shows the schematic representation of machining periodic microstructures on the flat and curved surface by MTD tool under constant or variable forces. The experimental configuration and the cutting principle of proposed tip-based force control system are illustrated in the previous study [28]. This modified four-axis micromachining system consists of two high-precision stages (X,Y) driven by air floatation with the resolution of 1 nm, a motor driven coarse stage (Z) with the resolution of 0.5 μm and an air-bearing rotary stage (C) with radial rotation accuracy 0.26 μm.…”

Cutting force modeling and control of single crystal silicon using wire saw velocity reciprocation

“…The results indicate that when the wire-line velocity is constant, with the increase of the feeding force the maximum cutting depth increases. Yan et al 17 presented a constant force–controlled cutting approach with two different geometries of cutting tools. Two theoretical models were proposed to quantitatively predict the required applied normal forces at the expected machined depths, which were obtained with a solution to the horizontal projection of the sample–tip contact area and the multi-edge form tip based on a generalized cutting approach, respectively Li et al 18 conducted experiments and found that certain feed angles of the diamond wire saw can be chosen to obtain the least surface shape deviation and reduce the influence of anisotropy of silicon.…”

Single diamond grit scratching of unidirectional Cf/SiC composite: Mechanical responses and fracture mechanism

“…Scratching tests are mostly used to investigate the material damage removal mechanism, [32][33][34][35][36] and unidirectional C f /SiC composites can effectively avoid the interaction of fibers in different directions, which is an ideal method to understand the removal mechanism. Li et al 37 conducted single grit grinding mechanism of C f / SiC through finite element simulation by analyzing the grinding forces and related fracture features.…”