Effect of Mg addition on Fe phase morphology, distribution and aging kinetics of Cu-6.5Fe alloy

Yuan, Dawei; Zeng, Hao; Xiao, Xiangpeng; Wang, Hang; Han, Bo; Liu, Baixiong

doi:10.1016/j.msea.2021.141064

Cited by 58 publications

(16 citation statements)

References 43 publications

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“…Although bare Cu wire has some advantages over Au wire, it still has many hurdles and cannot be used directly in industry [ 69 ]. Bare Cu wire is easy to be oxidized in air, and additional cost of forming gas, a mixture of 95% N 2 and 5% H 2 , must be considered [ 70 ].…”

Section: Cu Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

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Section: Cu Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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“…The Cu-Fe alloys with high Fe content are a dual-phase and fibre-reinforced alloy, which combines the electrical conductivity, thermal conductivity and ductility of Cu and the magnetic properties, wear resistance, high elasticity and high hardness of Fe [1,2]. However, due to the high melt temperature of Cu Fe alloy, the ingot is prone to pinholes, shrinkage and other defects in the cold mould casting process, resulting in cracks in the subsequent processing [3].…”

Section: Introductionmentioning

confidence: 99%

“…The Fe phase is fibrillated during cold deformation, but the coarse Fe phase has a greater deformation resistance, which leads to a significant reduction in the degree of fibrillation. It is not conducive to the fibre strengthening effect of Cu-Fe alloys [2]. Therefore, eliminating ingot defects and optimising Fe phase morphology are the key factors for the preparation of high-performance Cu-Fe alloy materials.…”

Section: Introductionmentioning

confidence: 99%

Study on microstructure evolution and hot deformation behaviour of Cu–6.5Fe–0.3Mg alloy

Wang

Luo

Yuan

et al. 2023

Materials Science and Technology

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The hot deformation behaviour and microstructure evolution of the Cu–6.5Fe–0.3Mg alloy were explored. The optimum hot working temperature of the alloy was 950°C and the strain rate was 10 s−1. The alloy underwent dynamic recovery (DRV) and dynamic recrystallisation (DRX) behaviour during hot compression. The density of the Fe phase particles increased significantly, and they were all aligned along the vertical compression direction. The α-Fe phase transformed to γ-Fe phase at 950°C. A large amount of α-Fe and γ-Fe phases effectively inhibited the DRX behaviour of the Cu–6.5Fe–0.3Mg alloy and significantly improved its thermal stability. The research on the hot deformation behaviour of the Cu–6.5Fe–X alloys had a theoretical guiding role in determining its hot working process. Highlights The optimal hot deformation process of Cu–6.5Fe–0.3Mg alloy was clarified. Constitutive equations and thermal working diagrams of the alloys are constructed Thermal deformation significantly increases Fe particle density, optimising its distribution. the transformation of α-Fe phase to γ-Fe phase during the hot compression at 950°C. The increasing in Fe phase significantly inhibits the dynamic recrystallization of the alloy.

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“…Copper is widely used in various fields of electrical transmission due to its excellent electrical conductivity (EC), thermal conductivity, and corrosion resistance. However, pure copper has low strength and hardness, and even through work hardening, the strength and hardness are still insufficient for industrial applications [1]. The development of new high-strength and high-electrical conductivity copper alloys has become one of the current research hotspots.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and properties of cold-drawn Cu and Cu-Fe alloy wires

Yang

Zhang

Fang

2022

IOP Conf. Ser.: Mater. Sci. Eng.

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Copper and Cu-Fe alloy wires were cold drawn at room temperature, and the microstructure and properties were characterized and analyzed. The results show that, at the same drawing strain, the strength and ductility of Cu-Fe wires are higher than those of copper wires. At a drawing strain of 4, the tensile elongation of Cu-Fe alloy wires is about 5%, much higher than 2% for pure copper wires. For Cu-Fe wires, with increasing drawing strain, the Fe phase is elongated along the drawing direction and forms a fiber structure with a <110> texture. In addition to the <111> and <100> fiber textures in the copper wire, a high-intensity of texture with a <112> orientation forms in Cu-Fe alloy wires. The ductility of the Cu-Fe alloy wires is greatly preserved due to dynamic recrystallization. Moreover, with the additional refining effect of nano-copper fibers in the Fe phase, the strength of the material is greatly improved.

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Effect of Mg addition on Fe phase morphology, distribution and aging kinetics of Cu-6.5Fe alloy

Cited by 58 publications

References 43 publications

Research Progress on Bonding Wire for Microelectronic Packaging

Research Progress on Bonding Wire for Microelectronic Packaging

Study on microstructure evolution and hot deformation behaviour of Cu–6.5Fe–0.3Mg alloy

Microstructure and properties of cold-drawn Cu and Cu-Fe alloy wires

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