2018
DOI: 10.1039/c8ra04784g
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Effect of Mn doping on electroforming and threshold voltages of bipolar resistive switching in Al/Mn : NiO/ITO

Abstract: We investigated the bipolar resistive switching (BRS) properties of Mn-doped NiO thin films by sol–gel spin-coating.

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Cited by 17 publications
(4 citation statements)
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“…In the second step, we recalculated the selected 236 candidates with low force criteria (<0.01 eV/A) then ranked them from lowest to highest according to DFE [ V X ]. Since the lower DFE [ V X ] leads to the higher V X concentration, it can lower the operating voltage of the RSM device 55 . Thus, we chose the 22 compounds that had the lowest DFE [ V X ] among the 236 compounds.…”
Section: Resultsmentioning
confidence: 99%
“…In the second step, we recalculated the selected 236 candidates with low force criteria (<0.01 eV/A) then ranked them from lowest to highest according to DFE [ V X ]. Since the lower DFE [ V X ] leads to the higher V X concentration, it can lower the operating voltage of the RSM device 55 . Thus, we chose the 22 compounds that had the lowest DFE [ V X ] among the 236 compounds.…”
Section: Resultsmentioning
confidence: 99%
“…Cabe acentuar que el parámetro de red obtenido en ambos sistemas independientemente del pseudopotencial empleado entre más reducido sea el valor menor las distancias interatómicas, lo que tiene relación directa con los electrones de valencia que definen la banda de valencia, provocando el solapamiento de estados e incrementando la dificultad para que los electrones alleguen a la banda de conducción (Zekry, 2017) (Ge et al, 2018). En ese régimen la reducción de la brecha prohibida en ambos casos es menor con el pseudopotencial GGA ya que al optimizar la estructura el valor del a0 (parámetro de red) es mayor y las distancias interatómicas por lo tanto aumentan.…”
Section: Resultados Y Discusiónunclassified
“…由于Ni原 子具有多种化合价态, 因此NiO x 薄膜RRAM器 件的翻转电压通常弥散性较大 [6] , 数据持久性和循 环耐受性也有待进一步提高 [7,8] . 在过去的半个多 世纪里, 研究者们通过在NiO x 中掺杂各种电化学 活性材料(如Li [9,10] , Ti [11] , P [12] , Mn [13] , Cu [14] , W [15] , Nb [16] 等)改变电阻翻转层载流子浓度; 或者通过插 入各种界面缓冲层(如Al 2 O 3 [6] , Ta [17] , Pt [18] , IrO 2 [19] ,…”
Section: Rram核心单元通常为金属-绝缘体-金属三unclassified