Effect of montmorillonite on thermal and moisture absorption properties of polyimide of different chemical structures

Tyan, Horng‐Long; Wu, Chao‐Yin; Wei, Kung‐Hwa

doi:10.1002/app.1606

Cited by 41 publications

(13 citation statements)

References 49 publications

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“…For their application as high-performance polymers, polyimides (PIs) have been widely used in optoelectronics, adhesives, aerospace applications, and the microelectronics industry because of their high electrical resistivity, 1 good adhesivity, 2 low moisture absorption, 3 superior thermal stability, 4 excellent mechanical properties, 5 and chemical stability. 6 Moreover, PIs are utilized for film materials to prevent adsorption of gas mixtures.…”

Section: Introductionmentioning

confidence: 99%

Improving the mechanical, electrical, and thermal properties of polyimide by incorporating functionalized graphene oxide

Wang

Lan

et al. 2016

High Performance Polymers

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In this study, we have developed a facile and effective method for fabricating polyimide (PI)-based nanocomposites incorporating octadecylamine (ODA)-functionalized graphene oxide (ODA-fGO) nanosheets. ODA-fGO sheets exhibit superior dispersibility and compatibility with the PI matrix and are successfully obtained through a chemical reaction between graphene oxide (GO) and ODA. The PI-based composites of various loading content of ODA-fGO sheets were prepared via in situ polymerization and thermal imidization process. The mechanical and electrical properties of the PI/ ODA-fGO composites were significantly improved relative to pure PI because of the excellent dispersion of ODA-fGO and the adequate compatibility between fillers and the PI matrix. A 40.7% increase in tensile strength and a 95.5% improvement of Young's modulus were observed for the 3 wt% ODA-fGO (PI/3 wt% ODA-fGO) loading content composite. The electrical and thermal conductivity of PI/3 wt% ODA-fGO was 3.8 Â 10 À2 S m À1 and 0.468 W m À1 K À1 , respectively, which is more than 10 11 times and almost 3 times higher than that of pure PI. The reported approach provides an effective strategy for developing high-performance and multifunctional polymer-based composite materials.

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Section: Introductionmentioning

confidence: 99%

Improving the mechanical, electrical, and thermal properties of polyimide by incorporating functionalized graphene oxide

Wang

Lan

et al. 2016

High Performance Polymers

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“…[7][8][9][10][11][12][13] Recent development in layered silicates/PI composites indicates that these composites possess excellent mechanical properties, thermal stability, and gas barrier properties. [14][15][16][17][18][19][20][21] Mica is a natural mineral with good electrical and thermal insulating properties. It is composed of a layered silicate structure with dimensions of about 1 230 nm in length and 1 nm in thickness.…”

Section: Introductionmentioning

confidence: 99%

Dielectric Properties of Polyimide‐Mica Hybrid Films

Zhang

Dang

Xin

et al. 2005

Macromol. Rapid Commun.

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Summary: Polyimide‐mica hybrid films were prepared via ultrasonic dispersion and in situ polymerization process from a solution of a polyimide precursor and mica in N,N‐dimethylacetamide, and their structure was characterized by FTIR and XRD techniques. The dependence of dielectric properties, such as dielectric constant and electrical breakdown strength, of the hybrid films on the content of mica was studied at room and cryogenic temperatures. The results show that the dielectric constant of PI‐mica hybrid films decreases with the increase of the mica content at temperatures from −150 to 150 °C and at frequency range from 1 kHz to 1 MHz. It was found that the cryogenic electrical breakdown strength of the PI‐mica hybrid films could meet the requirements of cryogenic insulating materials.Effect of frequency on the dielectric constant of PI‐mica hybrid films at 140 °C at the frequency from 1 kHz to 1 MHz.magnified imageEffect of frequency on the dielectric constant of PI‐mica hybrid films at 140 °C at the frequency from 1 kHz to 1 MHz.

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“…The lowest CTE value for the Cloisite 15A hybrid films (i.e., 63 ppm/°C) was observed at a loading of 1.0 wt%. These reductions in the CTE values of the PI hybrids are ascribed to the thermal stability provided by the clay,39, 40 as well as to the dispersion and high aspect ratio of the clay layers. Upon increasing the amount of organoclay from 1.0 to 3.0 wt%, the CTE increases to 72 ppm/°C, as shown in Table 2.…”

Section: Resultsmentioning

confidence: 98%

Colorless polyimide nanocomposite films containing hexafluoroisopropylidene group

Choi

Chang

2011

Polymers for Advanced Techs

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Poly(amic acid) (PAA) was prepared by the reaction of 4,4'‐(hexafluoro‐isopropylidene)diphthalic anhydride (6FDA) with 2,2'‐bis[4‐(4‐aminophenoxy)phenyl] hexafluoropropane (BAPP) in N,N‐dimethylacetamide (DMAc). Hybrid films were obtained from blend solutions of the precursor polymer and the organoclay Cloisite 15A, varying the organoclay content from 0 to 3.0 wt%. The cast PAA film was heat‐treated at different temperatures to create polyimide (PI) hybrid films, which showed excellent optical transparencies and were almost colorless. The intercalation of PI chains in the organoclays was examined by means of wide‐angle X‐ray diffraction (XRD) and electron microscopy (SEM and TEM). In addition, the thermo‐mechanical properties were tested using a differential scanning calorimeter (DSC), a thermogravimetric analyzer (TGA), and a universal tensile machine (UTM). In the XRD, SEM, and TEM results for the PI hybrid films, a substantial increase in the agglomeration of the clay particles was observed as the clay loading was increased from 0.5 to 3.0 wt%. This suggests that in the hybrid materials with low clay content, the clay particles are better dispersed in the matrix polymer and do not agglomerate significantly. We found that the addition of a small amount of organoclay is sufficient to improve the thermal and mechanical properties of the PI, with the maximum enhancement being observed at 1.0 wt% Cloisite 15A. Copyright © 2009 John Wiley & Sons, Ltd.

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Effect of montmorillonite on thermal and moisture absorption properties of polyimide of different chemical structures

Cited by 41 publications

References 49 publications

Improving the mechanical, electrical, and thermal properties of polyimide by incorporating functionalized graphene oxide

Improving the mechanical, electrical, and thermal properties of polyimide by incorporating functionalized graphene oxide

Dielectric Properties of Polyimide‐Mica Hybrid Films

Colorless polyimide nanocomposite films containing hexafluoroisopropylidene group

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