2016
DOI: 10.1016/j.tsf.2016.04.043
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Effect of N2 flow rate on the microstructure and electrochemical behavior of TaNx films deposited by modulated pulsed power magnetron sputtering

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Cited by 27 publications
(12 citation statements)
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“…So, it should be noticed that the coating with a content of 5.2% P N2 /P Ar (Sample A) possesses the inner layer least resistance (0.70 MΩ.cm 2 ) as well as the outer layer least resistance (204.16 kΩ.cm 2 ) due to cavities over the surface and the ions penetration into the solution and so exhibits the least corrosion resistance (Table 2). The corrosion resistance of formed coatings raises by increasing the time of immersion within the coating procedure, since rising the time of immersion results in a thick passive layer formation having higher corrosion resistance for the coating 46 . This characteristic is seen in the formed coatings in P N2 /P Ar 5.2%, 11.1%, and 17.6%.…”
Section: Resultsmentioning
confidence: 96%
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“…So, it should be noticed that the coating with a content of 5.2% P N2 /P Ar (Sample A) possesses the inner layer least resistance (0.70 MΩ.cm 2 ) as well as the outer layer least resistance (204.16 kΩ.cm 2 ) due to cavities over the surface and the ions penetration into the solution and so exhibits the least corrosion resistance (Table 2). The corrosion resistance of formed coatings raises by increasing the time of immersion within the coating procedure, since rising the time of immersion results in a thick passive layer formation having higher corrosion resistance for the coating 46 . This characteristic is seen in the formed coatings in P N2 /P Ar 5.2%, 11.1%, and 17.6%.…”
Section: Resultsmentioning
confidence: 96%
“…The corrosion resistance of formed coatings raises by increasing the time of immersion within the coating procedure, since rising the time of immersion results in a thick passive layer formation having higher corrosion resistance for the coating. 46 This characteristic is seen in the formed coatings in P N2 /P Ar 5.2%, 11.1%, and 17.6%.…”
Section: Eis and Pdp Testsmentioning
confidence: 84%
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“…The growth rate of the SEM-derived coating was 125 and 93.5 nm/min for Coatings 1A and 2N, respectively. The decrease in the coating growth rate upon the transition from argon to nitrogen sputtering atmosphere can be explained by the easier ionization of argon as compared to nitrogen [ 42 , 43 ]. Additionally, the sputtered atoms from the target experience more scattering during their flight to the substrate when a heavier working gas is used.…”
Section: Resultsmentioning
confidence: 99%