2017
DOI: 10.1142/s0217984917500828
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Effect of Ni–P alloy coating on microstructures and properties of vacuum brazed joints of SiCp/Al composites

Abstract: Compared without electroless Ni–P alloy coating on the SiCp/Al composites, the paper describes the effect of Ni–P deposited layer on the microstructure evolution, shear strength, airtightness and fracture behavior of vacuum brazed joints. Void free and compact reaction layers along the 6063Al/Ni–P deposited layer/filler metal interfaces indicated that the joints exhibit high airtightness with He-leakage less than [Formula: see text] [Formula: see text]. Energy Dispersive X-ray Spectroscopy (EDS) analysis showe… Show more

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Cited by 4 publications
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“…At present, metals such as Ni-P [ 90 ], MgO [ 54 ], Cu [ 91 ], Cr [ 92 ] and Ti [ 93 , 94 ] are all deposited on the surface of SiCp as coatings to prevent contact between SiCp and molten Al and inhibit the occurrence of adverse interface reactions. Li et al [ 95 ] the electroless plating method is adopted to Cu plating on the surface of SiCp, by means of pressureless infiltration technique was used to prepare the SiCp/Al composite materials, has not found the existence of Al 4 C 3 , explains the Cu coating can effectively inhibit really interface reaction, but it does not represent no interface reaction.…”
Section: Current Status Of Metal-based Electronic Packaging Materialsmentioning
confidence: 99%
“…At present, metals such as Ni-P [ 90 ], MgO [ 54 ], Cu [ 91 ], Cr [ 92 ] and Ti [ 93 , 94 ] are all deposited on the surface of SiCp as coatings to prevent contact between SiCp and molten Al and inhibit the occurrence of adverse interface reactions. Li et al [ 95 ] the electroless plating method is adopted to Cu plating on the surface of SiCp, by means of pressureless infiltration technique was used to prepare the SiCp/Al composite materials, has not found the existence of Al 4 C 3 , explains the Cu coating can effectively inhibit really interface reaction, but it does not represent no interface reaction.…”
Section: Current Status Of Metal-based Electronic Packaging Materialsmentioning
confidence: 99%