2006
DOI: 10.1149/1.2209315
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Effect of Nitridation on 1/f Noise in n-MOSFETs with High-k Dielectric

Abstract: This paper reports the nitridation effects on 1/f noise in n-MOSFETs with MOCVD HfO 2 as gate dielectric. Nitridation of the gate oxides was carried out by using a post-deposition anneal (PDA) process in a N 2 or NH 3 ambient. Predominantly 1/f γ type noise is observed, with γ ~ 1. For non-nitrided interfaces, significant variation in noise was observed when different PDAs are employed. Among the studied PDAs, devices annealed with N 2 show the lowest input referred noise, close to ITRS specifications when com… Show more

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Cited by 4 publications
(4 citation statements)
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“…Compared to the ITRS specification value of 200 V 2 /Hz for analog CMOS applications, at least a one-decade higher noise is observed in these high-k devices. 28 As an alternative figure of merit parameter, Hooge's constant ␣ H is calculated as NfS id /I d 2 , 29 with N the total number of carriers in the channel, which is calculated from…”
Section: G326mentioning
confidence: 99%
“…Compared to the ITRS specification value of 200 V 2 /Hz for analog CMOS applications, at least a one-decade higher noise is observed in these high-k devices. 28 As an alternative figure of merit parameter, Hooge's constant ␣ H is calculated as NfS id /I d 2 , 29 with N the total number of carriers in the channel, which is calculated from…”
Section: G326mentioning
confidence: 99%
“…There are no noise data reported for these devices. However, some recent experiments by the authors [11] indicate that a nitridation of the interface (Decoupled Plasma Nitridation step -DPN with 7-9% N 2 at the interface) before a MOCVD HfO 2 deposition leads to a one order of magnitude increase in noise performance, as illustrated in Fig. 3a.…”
Section: A the Sio 2 Interfacial Layermentioning
confidence: 95%
“…The typical elements that could possibly impact the low-frequency noise performance are 1) the Si/SiO 2 interfacial layer (IL) interface, 2) the properties of the interfacial layers (thickness, composition, quality), 3) the IL/high-κ interface, 4) properties of the high-κ layers (thickness, κ-value, defect density, deposition technique), 5) the high-κ/gate electrode interface, 6) the gate electrode properties like thickness and composition (poly-Si, FUSI, metal). The pre-and/or post deposition anneal steps also strongly impacts the noise performance [11]. In addition, the noise performance is also influenced by the substrate strain engineering implemented in the processing [12], as indicated by (7) in Fig.…”
Section: Introductionmentioning
confidence: 99%
“…To overcome this issue, several types of microchip-based systems(microdisk, micropillar, micro bottle, and photonic crystal cavities) [14] have been engineered and successfully utilized for implementing cavity-QED type of experiments [19][20][21][22][23][24][25] by coupling them with trapped cold atoms, quantum dots. Numerical and theoretical methods have also been developed to understand the optical properties of these systems [15][16][17][18].…”
Section: Introductionmentioning
confidence: 99%