Effect of Organosilane Underlayers on the Effectiveness of NiB Barrier Layers in ULSI Metallization

Yoshino, Masahiro; Aramaki, Hitoshi; Matsuda, Itsuaki; Okinaka, Y.; Osaka, Tetsuya

doi:10.1149/1.3072778

Cited by 7 publications

(12 citation statements)

References 12 publications

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“…In this study, electroless NiB plating was employed, and optimized for metallization of polymer microarchitectures. First, NiB films were formed on flat Au‐coated Si substrates with different immersion times in order to investigate the deposition rate and the properties of NiB.…”

Section: Resultsmentioning

confidence: 99%

“…Finally, the metallization was achieved via NiB electroless plating (Figure (4)) at a constant temperature of 70 °C and pH of 9. The plating bath consisted of 0.1 mol L −1 nickel sulphate, 0.2 mol L −1 potassium citrate and 0.05 mol L −1 dimethyl amine borane . The plating time was varied from 18 s to 3 min to achieve NiB film thicknesses ranging from 10 to 100 nm on the templates.…”

Section: Methodsmentioning

confidence: 99%

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Micromechanics of Amorphous Metal/Polymer Hybrid Structures with 3D Cellular Architectures: Size Effects, Buckling Behavior, and Energy Absorption Capability

Mieszala

Hasegawa

Guillonneau

et al. 2016

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By designing advantageous cellular geometries and combining the material size effects at the nanometer scale, lightweight hybrid microarchitectured materials with tailored structural properties are achieved. Prior studies reported the mechanical properties of high strength cellular ceramic composites, obtained by atomic layer deposition. However, few studies have examined the properties of similar structures with metal coatings. To determine the mechanical performance of polymer cellular structures reinforced with a metal coating, 3D laser lithography and electroless deposition of an amorphous layer of nickel-boron (NiB) is used for the first time to produce metal/polymer hybrid structures. In this work, the mechanical response of microarchitectured structures is investigated with an emphasis on the effects of the architecture and the amorphous NiB thickness on their deformation mechanisms and energy absorption capability. Microcompression experiments show an enhancement of the mechanical properties with the NiB thickness, suggesting that the deformation mechanism and the buckling behavior are controlled by the brittle-to-ductile transition in the NiB layer. In addition, the energy absorption properties demonstrate the possibility of tuning the energy absorption efficiency with adequate designs. These findings suggest that microarchitectured metal/polymer hybrid structures are effective in producing materials with unique property combinations.

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Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Micromechanics of Amorphous Metal/Polymer Hybrid Structures with 3D Cellular Architectures: Size Effects, Buckling Behavior, and Energy Absorption Capability

Mieszala

Hasegawa

Guillonneau

et al. 2016

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“…Electroless barrier layers (EBLs), which are ultrathin (<10 nm) and amenable to conformal deposition, have been proposed as the alternative process using an organosilane monolayer (OSML), and the barrier effectiveness against Cu thermal diffusion up to 400 C was reported with 6-nm-thick NiB and 10-nm-thick CoWP/NiB barrier layers. [14][15][16] It was also reported that 3-[2-(2-aminoethylamino)ethyl-amino]propyltrimethoxysilane (TAS) is superior to aminopropyltriethoxysilane (APTES) as the OSML for depositing thin and uniform NiB layers with reduced surface roughness. 15,16) However, further evaluation under bias temperature stress (BTS) is required for device applications to guarantee the barrier integrity in its operation under bias stress.…”

Section: Introductionmentioning

confidence: 99%

“…[14][15][16] It was also reported that 3-[2-(2-aminoethylamino)ethyl-amino]propyltrimethoxysilane (TAS) is superior to aminopropyltriethoxysilane (APTES) as the OSML for depositing thin and uniform NiB layers with reduced surface roughness. 15,16) However, further evaluation under bias temperature stress (BTS) is required for device applications to guarantee the barrier integrity in its operation under bias stress.…”

Section: Introductionmentioning

confidence: 99%

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Barrier Integrity of Electroless Diffusion Barriers and Organosilane Monolayer against Copper Diffusion under Bias Temperature Stress

Mitsumori¹,

Fujishima²,

Ueno³

2012

Jpn. J. Appl. Phys.

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Barrier integrity of electroless NiB and CoWP/NiB thin layers against copper (Cu) diffusion was evaluated by time-dependent dielectric breakdown (TDDB) under bias temperature stress (BTS) using metal oxide semiconductor (MOS) test structures. The BTS tests were carried out also for an approximately 2.2-nm-thick organosilane monolayer (OSML), which has been used as the underlayer of the electroless barrier layers (EBLs). It was found that the barrier integrity of the EBLs was NiB 40 nm > NiB 10 nm > CoWP/NiB 40 nm = CoWP/NiB 10 nm in this order. The field acceleration parameter of the TDDB lifetime was almost the same for all EBLs. Initial failures and wide lifetime distributions were observed for CoWP/NiB when the NiB catalyst layer for CoWP was not thick enough, which is considered to be due to the large surface roughness. In addition, the OSML was found to have some barrier properties. Although the reliability of OSML was inferior to electroless NiB and CoWP/NiB barrier layers, it is considered that the barrier integrity of the EBLs was partially supported by the OSML.

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Initial catalyzation analysis of electroless NiP nanoimprinting mold replicated from self-assembled monolayer modified nanopatterns

Lin

Saito

Homma

2012

Electrochimica Acta

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Effect of Organosilane Underlayers on the Effectiveness of NiB Barrier Layers in ULSI Metallization

Cited by 7 publications

References 12 publications

Micromechanics of Amorphous Metal/Polymer Hybrid Structures with 3D Cellular Architectures: Size Effects, Buckling Behavior, and Energy Absorption Capability

Micromechanics of Amorphous Metal/Polymer Hybrid Structures with 3D Cellular Architectures: Size Effects, Buckling Behavior, and Energy Absorption Capability

Barrier Integrity of Electroless Diffusion Barriers and Organosilane Monolayer against Copper Diffusion under Bias Temperature Stress

Initial catalyzation analysis of electroless NiP nanoimprinting mold replicated from self-assembled monolayer modified nanopatterns

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