Effect of oxygen plasma etching on adhesion between polyimide films and metal

Nakamura, Yoshikazu; Suzuki, Yasufumi; Watanabe, Yukihiko

doi:10.1016/s0040-6090(96)09017-7

Cited by 82 publications

(50 citation statements)

References 3 publications

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“…The surface of the PDMS substrate is modified by oxygen plasma to improve the adhesive strength between the PDMS substrate and the metal layer (Figure 2(a)). The adhesive strength is affected both by the chemical state of bonding and the morphology of the surface [20]. A layer of Cr-Au with a thickness of 300 nm is deposited by sputtering as the bottom electrodes on the PDMS substrate.…”

Section: Methodsmentioning

confidence: 99%

Reactive ion etching of poly(vinylidene fluoride-trifluoroethylene) copolymer for flexible piezoelectric devices

et al. 2013

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A microfabrication process for poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)) based flexible piezoelectric devices is proposed using heat controlled spin coating and reactive ion etching (RIE) techniques. Dry etching of P(VDF-TrFE) in CF 4 +O 2 plasma is found to be more effective than that using SF 6 +O 2 or Ar+O 2 feed gas with the same radiofrequency power and pressure conditions. A maximum etching rate of 400 nm/min is obtained using the CF 4 +O 2 plasma with an oxygen concentration of 60% at , and heart beat sensors [7]. Cantilever shaped P(VDF-TrFE) actuators were also fabricated for mini-robots application, in which a multilayered P(VDF-TrFE) structure was proposed to achieve a large displacement with a low driving voltage [8]. Most of the PVDF based devices were fabricated using commercial PVDF films and traditional fabrication techniques such as scissoring, laser machining, and lamination [9,10]. With the aim of integrating piezoelectric polymers into microdevices, ionized evaporation, electrospray, electrospun, Langmuir-Blodgett deposition, and heat controlled spin coating methods were developed. Ionized evaporation and electrospray processes were reported to deposit PVDF films for pyroelectric infrared sensors in 1990s [11,12]. An electrospun method was employed to fabricate PVDF nanofibers for sensors and energy harvesters [5,13]. For fabrication of nonvolatile memory devices, low-temperature fabrication approaches including Langmuir-Blodgett deposition [14,15] and spin coating methods [16] were developed. The spin coated P(VDF-TrFE) films, intrinsically tending to form phase I crystal with a high remanent polarization, are

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Section: Methodsmentioning

confidence: 99%

Reactive ion etching of poly(vinylidene fluoride-trifluoroethylene) copolymer for flexible piezoelectric devices

et al. 2013

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“…However, plasma-derived high energy states only last for short time as surfaces tend to relax back to their original state. [8][9][10][11] Indeed, electrostatic forces are among the strongest physical attractive forces and are successful for applications in low-humidity environments. In the field of implantable medical systems-where polymer-based carriers are implanted into the humid body environments-plasma treatments have instead only short-term success.…”

Section: Introductionmentioning

confidence: 99%

Incorporation of Silicon Carbide and Diamond‐Like Carbon as Adhesion Promoters Improves In Vitro and In Vivo Stability of Thin‐Film Glassy Carbon Electrocorticography Arrays

Vomero¹,

Castagnola

Ordonez³

et al. 2017

Adv. Biosys.

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Thin‐film neural devices are an appealing alternative to traditional implants, although their chronic stability remains matter of investigation. In this study, a chronically stable class of thin‐film devices for electrocorticography is manufactured incorporating silicon carbide and diamond‐like carbon as adhesion promoters between glassy carbon (GC) electrodes and polyimide and between GC and platinum traces. The devices are aged in three solutions—phosphate‐buffered saline (PBS), 30 × 10−3 and 150 × 10−3m H2O2/PBS—and stressed using cyclic voltammetry (2500 cycles) and 20 million biphasic pulses. Electrochemical impedance spectroscopy (EIS) and image analysis are performed to detect eventual changes of the electrodes morphology. Results demonstrate that the devices are able to undergo chemically induced oxidative stress and electrical stimulation without failing but actually improving their electrical performance until a steady state is reached. Additionally, cell viability tests are carried out to verify the noncytotoxicity of the materials, before chronically implanting them into rat models. The behavior of the GC electrodes in vivo is monitored through EIS and sensorimotor evoked potential recordings which confirm that, with GC being activated, impedance lowers and quality of recorded signal improves. Histological analysis of the brain tissue is performed and shows no sign of severe immune reaction to the implant.

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“…[18][19][20][21] In this study, titanium alkoxide was incorporated into the PIS matrix to reduce the thermal expansion and enhance the adhesion strength between PIS and copper. Nanosized titanium oxide was formed in situ using acetylacetone (acac) as a chelating agent to stabilize titanium ethoxide (Ti(OEt) 4 ) in poly(amic acid siloxane) (PAAS). No acid catalyst or water was added to the PAAS/ Ti(OEt) 4 solution.…”

Section: Introductionmentioning

confidence: 99%

“…Nanosized titanium oxide was formed in situ using acetylacetone (acac) as a chelating agent to stabilize titanium ethoxide (Ti(OEt) 4 ) in poly(amic acid siloxane) (PAAS). No acid catalyst or water was added to the PAAS/ Ti(OEt) 4 solution. The goal of this work was to investigate the surface compositions of Si and Ti on the prepared PIS/TiO 2 hybrid films as well as the influences of the surface content on thermal and mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

Effect of TiO₂ on thermal and adhesive characteristics of poly(imide siloxane)/TiO₂ hybrid films

Tseng

Whang

et al. 2011

J of Applied Polymer Sci

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A novel poly(imide siloxane)/titania (PIS/ TiO 2 ) hybrid film was fabricated by sol-gel process via in situ formation of TiO 2 within PIS matrix. Poly(amic acid siloxane) (PAAS) was prepared from 4,4 0 -oxydiphthalic anhydride, 2,2-bis [4-(4-aminophenoxy) phenyl] propane, and a,x-bis(3-aminopropyl)polydimethylsiloxane (APPS). Chelating agent, acetylacetone, and catalyst-free polymerization were used to reduce the rate of hydrolysis of titanium alkoxide in the PAAS. X-ray photoelectron spectroscopy data showed that the presence of APPS promotes the Ti surface composition of PIS/TiO 2 hybrid film. The effects of TiO 2 and APPS contents on the characteristics of surface, thermostability, coefficient of thermal expansion (CTE), and the strength of adhesion were investigated. The presence of TiO 2 on the surface of the hybrid films enhanced the adhesive strength at the interface of PIS/TiO 2 hybrid film and copper foil. When more TiO 2 was incorporated into the PIS matrix, the PIS/TiO 2 hybrid film exhibited lower CTE while retaining favorable mechanical and thermal properties.

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Effect of oxygen plasma etching on adhesion between polyimide films and metal

Cited by 82 publications

References 3 publications

Reactive ion etching of poly(vinylidene fluoride-trifluoroethylene) copolymer for flexible piezoelectric devices

Reactive ion etching of poly(vinylidene fluoride-trifluoroethylene) copolymer for flexible piezoelectric devices

Incorporation of Silicon Carbide and Diamond‐Like Carbon as Adhesion Promoters Improves In Vitro and In Vivo Stability of Thin‐Film Glassy Carbon Electrocorticography Arrays

Effect of TiO₂ on thermal and adhesive characteristics of poly(imide siloxane)/TiO₂ hybrid films

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Effect of oxygen plasma etching on adhesion between polyimide films and metal

Cited by 82 publications

References 3 publications

Reactive ion etching of poly(vinylidene fluoride-trifluoroethylene) copolymer for flexible piezoelectric devices

Reactive ion etching of poly(vinylidene fluoride-trifluoroethylene) copolymer for flexible piezoelectric devices

Incorporation of Silicon Carbide and Diamond‐Like Carbon as Adhesion Promoters Improves In Vitro and In Vivo Stability of Thin‐Film Glassy Carbon Electrocorticography Arrays

Effect of TiO2 on thermal and adhesive characteristics of poly(imide siloxane)/TiO2 hybrid films

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Effect of TiO₂ on thermal and adhesive characteristics of poly(imide siloxane)/TiO₂ hybrid films