Effect of Pd(P) thickness on the soldering reaction between Sn–3Ag–0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad

Ho, Cheng–En; Hsu, L.H.; Yang, Cheng‐Hsien; Yeh, T.C.; Lee, P.T.

doi:10.1016/j.tsf.2014.12.026

Cited by 17 publications

(2 citation statements)

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“…Soldering is a joining technology widely used to construct the electrical connection and mechanical support in between heterogeneous components in microelectronic products. This joining technology is accomplished by means of the liquid/solid (L/S) reaction, commonly called the reflow reaction, at a proper temperature, during which a low-melting-point alloy melts and reacts with the metallization of high melting points on two adjoining components [ 1 , 2 , 3 , 4 , 5 , 6 ]. Sn-based alloys such as SnAg and SnAgCu have a moderate melting point around 217–220 °C, making them suitable as joining materials.…”

Section: Introductionmentioning

confidence: 99%

“…Due to superior electrical and thermal properties, Cu is commonly used as the material for metallization in microelectronic products. Therefore, the liquid/solid reaction study of solder joints constructed using Sn-based alloy and Cu is an attractive and practically important issue [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 ].…”

Section: Introductionmentioning

confidence: 99%

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Effects of Initial Morphology on Growth Kinetics of Cu6Sn5 at SAC305/Cu Interface during Isothermal Aging

Lee

Chen

2022

Materials

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Solder/Cu joints are important components responsible for interconnection in microelectronics. Construction of the solder/Cu joints through liquid/solid (L/S) reactions accompanies the formation of the Cu–Sn intermetallic compounds (IMCs) at the joint interface. The Cu6Sn5 IMC exhibits remarkable distinctions in thickness and morphology upon increasing the L/S reaction time. Effects of the initial characteristics of thickness and morphology on the growth kinetics of Cu6Sn5 during subsequent isothermal aging were investigated. SAC305 solder was reflowed on a Cu electroplated layer at 265 °C for 1 to 60 min to produce the Cu6Sn5 IMC with different thickness and morphology at the SAC305/Cu interface. The as-fabricated SAC305/Cu joint samples were aged at 200 °C for 72 to 360 h to investigate the growth kinetics of Cu6Sn5. The results show that the initial characteristics of thickness and morphology significantly influenced the growth kinetics of Cu6Sn5 during the subsequent solid/solid (S/S) reaction. A prolonged L/S reaction time of 60 min (L/S-60) produced a scallop-type Cu6Sn5 IMC with a larger grain size and a thicker thickness, which reduced the quantity of fast diffusion path (grain boundary) and the magnitude of concentration gradient, thus slowing down the growth rate of Cu6Sn5. According to the growth kinetics analysis, the growth rate constant of Cu6Sn5 could be remarkably reduced to 0.151 µm/h0.5 for the L/S-60 sample, representing a significant reduction of 70 % compared to that of the L/S-1 sample (0.508 µm/h0.5 for L/S reaction time of 1 min).

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