Effect of Poling Atmosphere on Pb (Zr, Ti)O3 / Pb(Zr, Ti) O3 Sol-gel Composite

Hidaka, Makie; Nakatsuma, Kei; Kobayashi, Makiko

doi:10.1109/irsaeve52613.2021.9604016

Cited by 1 publication

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“…After BiT/TiO2 film forming process, the poling (Cai et al, 1995;Hidaka, M., Nakatsuma, K., Kobayashi, 2021) was performed under the corona discharge to give the sol-gel composite films piezoelectricity. Corona discharge (Xiaofeng et al, 2007;Waller, Iqbal, and Safari, 1989;Chang, Lawless, and Yamamoto, 1991) was conducted under approximately 40 kV output.…”

Section: Fabrication Process Of the Sol-gel Composite Piezoelectric S...mentioning

confidence: 99%

Directly mounted sol-gel composite piezoelectric devices by spray coating technique for high temperature ultrasonic transducers

NAKAMURA,

NAKATSUMA,

KUMON

et al. 2023

JAMDSM

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has been developed to fabricate a high-temperature-resistant and flexible piezoelectric device. The method employs a spray coating process to fabricate a porous ceramic film which porosity contributes the high-temperature characteristics and flexibility. Since the spray coating process is adopted, the piezoelectric films can be fabricated on various shapes such as sphere directly. In this paper, we introduce a novel approach to attach the film as an ultrasonic transducer on a high temperature equipment such as an exhaust tube of a furnace directly as shown in Fig. 2(b). Then, the performance of the device was evaluated in high temperature environments.The structure of the piezoelectric ultrasonic transducer is illustrated in Fig. 1. The film is sandwiched with the top and the bottom electrodes. The bottom electrode is a conductive substrate (e.g. stainless steel, carbon steel, titanium, etc.) on which the piezoelectric film is coated with the sol-gel composite spray method. The top electrode is attached on the film. In the traditional ultrasound non-destructive test, as shown in Fig. 2(a), the discrete and independent sensor probes are used. During the test, the couplant material (Glycerin is mainly used) which couples the sensor and the measuring object acoustically. Additionally, the backing material (Resins are mainly used) which absorbs backward ultrasonic waves and suppresses excess vibrations are commonly built into the probe. However, these materials have commonly no heat resistant (Mei et al., 2022). The temperature limit of couplant materials, which are currently widely used for ultrasonic

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Section: Fabrication Process Of the Sol-gel Composite Piezoelectric S...mentioning

confidence: 99%