2009
DOI: 10.1007/s10854-009-0017-y
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Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder

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Cited by 24 publications
(20 citation statements)
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“…(Zhang et al, 2014) have recommended that additions of 0.05 wt% of Ytterbium (Yb) in SAC improves the properties of SAC in electronic packaging and refines the microstructure by retarding the growth of IMCs during soldering. In another study by (Gao et al, 2010b), the incorporation of a small concentration of Praseodymium (Pr) in SAC has shown to produce extra PrSn 3 particles which restrict the IMCs growth because of the heterogeneous nucleation by lowering the reaction time of liquid solder with the substrate. However, more than 0.05 wt% of Pr resulted in the arrangement of bulk PrSn 3 compound.…”
Section: Microstructurementioning
confidence: 99%
“…(Zhang et al, 2014) have recommended that additions of 0.05 wt% of Ytterbium (Yb) in SAC improves the properties of SAC in electronic packaging and refines the microstructure by retarding the growth of IMCs during soldering. In another study by (Gao et al, 2010b), the incorporation of a small concentration of Praseodymium (Pr) in SAC has shown to produce extra PrSn 3 particles which restrict the IMCs growth because of the heterogeneous nucleation by lowering the reaction time of liquid solder with the substrate. However, more than 0.05 wt% of Pr resulted in the arrangement of bulk PrSn 3 compound.…”
Section: Microstructurementioning
confidence: 99%
“…Wettability improved by the refinement of the microstructure, which has also been reported by Wang et al [10] for addition of La and Ce into Al-Si filler. But with an excessive amount of RE element addition, the spearing area is decreased due to oxidation of the RE [28]. Adding small amounts of Sr could significantly modify the microstructure of the filler alloy so that this overdose could be avoided.…”
Section: Effect Of Sr Modified On Elements Distribution Of Al-si-zn Amentioning
confidence: 99%
“…In this paper, the behavior and mechanism of tin whisker growth in Sn-Zn series soldered joints In the previous research of solders doped with rare earth, the excess of rare earth addition would cause the formation of mass RE-phase. Therefore, the oxidation of these RE-phase was considered as the main reason which induced the tin whisker growth in the solder matrix [12][13][14]. However, there are various situations of tin whisker growth in soldered joints as shown in Figure 1.…”
Section: Introductionmentioning
confidence: 99%