Effect of rare earth addition on structure and properties of Ni-P coating on SiCp/Al composites

Li, Jianzhong; Yan-wen, Tian; Li, Ying; Wang, Xiangrong

doi:10.1016/s1002-0721(09)60198-8

Cited by 25 publications

(35 citation statements)

References 10 publications

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“…At higher bath concentrations of lanthanides, however, increased levels of lanthanide adsorption occur that eventually block surface sites binding H 2 PO 2 – . The decreased levels of H 2 PO 2 – on the surface lead to a reduction in the electron transfer rate and slow the plating, consistent with previously observed behaviors. ,,, …”

Section: Elementssupporting

confidence: 89%

“…Given their chemical similarities to the lanthanides, the metals scandium (Sc) and yttrium (Y) are sometimes included in discussions of the rare earths. In our case, however, Sc and Y EL baths have already been discussed separately (note Scandium and Yttrium section) and, with one exception ( vide infra ), are not included here.…”

Section: Elementsmentioning

confidence: 99%

“…The lanthanides (i.e., rare earths) are 15 metallic primarily 4f-block elements having atomic numbers ranging from 57 (i.e., lanthanum, Ln) to 71 (i.e., lutetium, Lu) in the Periodic Table . Given their chemical similarities to the lanthanides, the metals scandium (Sc) and yttrium (Y) are sometimes included in discussions of the rare earths. In our case, however, Sc and Y EL baths have already been discussed separately (note Scandium and Yttrium section) and, with one exception (vide inf ra), 204 are not included here.…”

Section: Acs Applied Electronic Materialsmentioning

confidence: 99%

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Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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Section: Elementssupporting

confidence: 89%

Section: Elementsmentioning

confidence: 99%

Section: Acs Applied Electronic Materialsmentioning

confidence: 99%

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Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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“…Most electronic configuration of the rare elements are owned d 0~2 , so they are of activation for substitution. The electronic configuration of metal element Ni, 4d 8 5s 2 , the orbits are rich with electron filled, and is not reactivity in activation for substitution [8]. Priority of discharging in activation for substitution of rare element can improve the electrode interface coordination ions in the electro-plating bath.…”

Section: Introductionmentioning

confidence: 99%

Effect of rare element cerium on the morphology and corrosion resistance of electro-less Ni-P coatings

Chuan-qi

Wang

et al. 2015

MATEC Web of Conferences

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Abstract. This paper reports an experimental study on the microstructure and corrosion resistance of electro-less Ni-P coatings with increasing content of the rare element cerium (Ce). Surface morphology and the composition of the electro-less Ni-P coatings were studied by scanning electron microscope (SEM), X-ray energy dispersed analysis (EDS) and X-ray diffraction analysis (XRD). Hardness and Adhesive force are researched by a HX-200 Vickers diamond indenter micro-hardness tester. Furthermore, we study the adhesive force by using the Revetest scratch tester. We get the possession of Ce amorphous Ni-P coatings which has excellent properties in anti-corrosion. The effect of the rare element cerium concentration on corrosion resistance of the coatings was evaluated in the groundwater immersion test and porosity test, respectively. The results indicated that added little the rare element cerium into the plating bath increased the phosphorus content of the coatings, decreased the corrosion rates, it also decreases the porosity of the amorphous Ni-P coatings. The lowest corrosion rates of the amorphous Ni-P coatings in groundwater immersion test is 4.1 um·h -1 , at the rare element cerium concentration of 0.12g·L -1.

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“…48 So the adsorption of La 3+ on PS surface might offer an amount of electronic orbit holes or free electrons, leading to a decrease in surface energy and an increase in nucleation rate. 49 The coalescence of uniform nanocrystallites forms upon repeated 3D nucleation at a higher nucleation rate. In addition, it has been proved that rare earth element can reduce surface tension and interfacial energy between the generated H 2 bubble and the as-deposited layer.…”

Section: Resultsmentioning

confidence: 99%

Preparation of Highly Uniform and Monodisperse PS/Cu Composite Microspheres Using Electroless Plating

Zhang

2012

J. Electrochem. Soc.

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Highly uniform and monodisperse core-shell microspheres composed of a polystyrene (PS) core and a copper shell were prepared by dispersion polymerization of styrene followed by electroless copper plating. The formation of copper shell on PS surface was confirmed by FESEM, TEM, XRD and TGA. As a result, the plating bath composition had an important influence on the morphology of PS/Cu composites. The addition of Na 2 EDTA and La 2 O 3 as a complexant and a stabilizer led to the formation of a more compact copper shell on PS surface. The formation mechanism was explored by the linear sweep voltammetry method, and the different morphology might mostly result from the various nucleation rates. Tailoring of shell thickness can be achieved through altering the loading of PS in the ECP bath. Conductivity of the PS/Cu composites with a shell thickness of 195 nm is up to 2.2×10 5 S/m. The PS/Cu composites may have great potential to be used as fillers of anisotropic conductive film for their uniform diameter, low density and good conductivity.As the requirements for interconnection and joining materials in microelectronics packaging applications have moved toward ultrafine-pitch bonding and environmental friendliness, anisotropic conductive film (ACF) has gained much attention as an alternative to tin/lead (Sn/Pb) solders. 1,2 ACF not only allow products to be thinner, smaller and lighter, but also offer good electrical performance and stability. 3 ACFs mainly consist of polymeric binder matrices and conductive fillers. 4 When heat and pressure are applied during bonding, the electric connection is established only in the Z-direction by using a relatively low weight loading of conductive fillers, typically 1-10 wt%. 5 Originally, carbon fibers were used as the conductive fillers for ACF. Then, the fillers were replaced by lead-free solder spheres and metal spheres, such as nickel, silver and gold-coated Ni spheres. 6 For instance, there has been growing interest in copper with various sizes and shapes used as filler of isotropic or anisotropic conductive adhesive owing to its high electrical, thermal conductivity, low cost and electro-migration tendency. 7-10

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Effect of rare earth addition on structure and properties of Ni-P coating on SiCp/Al composites

Cited by 25 publications

References 10 publications

Electroless Metallization of the Elements: Survey and Progress

Electroless Metallization of the Elements: Survey and Progress

Effect of rare element cerium on the morphology and corrosion resistance of electro-less Ni-P coatings

Preparation of Highly Uniform and Monodisperse PS/Cu Composite Microspheres Using Electroless Plating

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