Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy

Zeng, Xianwei; Liu, Yichi; Zhang, Jiankang; Liu, Yi; Hu, Xiaowu; Jiang, Xiongxin

doi:10.1007/s10854-020-04196-8

Cited by 7 publications

(4 citation statements)

References 38 publications

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“…As can be seen from Figure 4 a, the fracture of the Sn 29 Zn 5 solder alloy has obvious deep and larger dimples, indicating that it is a typical ductile fracture. It is well known that the plasticity of the material increases with the increase in the size and relative area fraction of the dimple, and the brittleness of the material enhances with the increase in the size and area of the cleavage under the same fracture condition [ 34 ]. The fracture of the Sn 29 Zn 4.8 Cu 0.2 solder alloy had more dimples than Sn 29 Zn 5 , which has excellent elongation.…”

Section: Resultsmentioning

confidence: 99%

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

et al. 2021

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The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile properties, wettability, interfacial characterization and melting behavior of the Sn-Zn-Cu solder alloys were investigated. The Sn29Zn4.6Cu0.4 solder alloy exhibited a fine microstructure, but the excessive substitution of the Cu atoms in the CPGA model resulted in extremely coarse intermetallic compound (IMC). The tensile tests revealed that with the increase in Cu content, the tensile strength of the solder alloy first increased and then slightly decreased, while its elongation increased slightly first and then decreased slightly. The tensile strength of the Sn29Zn4.6Cu0.4 solder alloy reached 95.3 MPa, which was 57% higher than the plain Sn-Zn solder alloy, which is attributed to the fine microstructure and second phase strengthening. The spreadability property analysis indicated that the wettability of the Sn-Zn-Cu solder alloys firstly increased and then decreased with the increase in Cu content. The spreading area of the Sn29Zn0.6Cu0.4 solder alloy was increased by 27.8% compared to that of the plain Sn-Zn solder due to Cu consuming excessive free state Zn. With the increase in Cu content, the thickness of the IMC layer decreased owing to Cu diminishing the diffusion force of Zn element to the interface.

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Section: Resultsmentioning

confidence: 99%

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

et al. 2021

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“…Enhanced mechanical properties, such as elastic moduli, ductility, ultimate tensile strength and micro-creep resistance of REcontaining solders, have been studied and reported. As these results indicate, RE elements would play an important role in providing better electronic interconnections (Xia et al, 2002;Chen et al, 2003;Zeng et al, 2020;Kang et al, 2021;Li et al, 2021;Rajendran et al, 2020). Rapid solidification processing (RSP) has usually been defined as cooling from the liquid state to the solid state at rates fast enough to achieve composition.…”

Section: Introductionmentioning

confidence: 99%

Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications

Shalaby,

Saad

2024

SSMT

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Purpose The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications. Design/methodology/approach Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element. Findings The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations. Originality/value It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.

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“…Sn–Ag solder with trace additive Zn formed Sn–Ag–Zn solder with low tin cost, environmental friendliness and good wettability. It had been reported that filling with Zn can change the dendrite organization and form finer eutectic in the matrix [ 31 , 32 ]. Ramos et al found that the addition of 0.1–0.7% Zn as an alloying element in SAC305 solder can reduce subcooling [ 33 , 34 ].…”

Section: Introductionmentioning

confidence: 99%

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Xiao,

Cheng,

Fu-kang

2024

Heliyon

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Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy

Cited by 7 publications

References 38 publications

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

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