Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad

Sharif, Ahmed; Chan, Y.C.

doi:10.1007/s11664-006-0162-5

Cited by 14 publications

(4 citation statements)

References 14 publications

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“…4). As a result, the forces became higher with extended reflow because of the larger sheared area [17]. Detailed cross-sectional studies were carried out to investigate the relationship between the shear strength and the interfacial morphologies of the solder with the pad metallizations.…”

Section: Resultsmentioning

confidence: 99%

Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints

Sharif

Chan

2007

Microelectronic Engineering

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Section: Resultsmentioning

confidence: 99%

Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints

Sharif

Chan

2007

Microelectronic Engineering

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“…Indeed it has been reported before that bulk solder strength can increase with thermal aging time when the aging temperature is no more than 160°C 25 or with reflow duration within a relatively short duration. 27 There has been no sound explanation for this increase so far, but we believe that it could be explained by increased dissolution of metallization metals into the bulk solder. Upon cooling, a greater volume fraction of IMC particles will precipitate out in the solder matrix, leading to an increase in solder strength.…”

Section: Effect Of Electromigration On the Mechanical Properties Of Smentioning

confidence: 85%

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

Kumar

Yang

Wong

et al. 2008

Journal of Elec Materi

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The effect of moderate electric current density (1 9 10 3 to 3 9 10 3 A/cm 2 ) on the mechanical properties of Ni-P/Sn-3.5Ag/Ni-P and Ni/Sn-3.5Ag/Ni solder joints was investigated using a microtensile test. Thermal aging was carried out at 160°C for 100 h while the current was passed. The interfacial microstructure and intermetallic compound (IMC) growth were analyzed. It was found that, at these levels of current density, there were no observable voids or hillocks. Samples aged at 160°C without current stressing failed mostly inside the bulk solder with significant prior plastic deformation. The passage of current was found to cause brittle failure of the solder joints and this tendency for brittle failure increased with increasing current density. Fractographic analysis showed that, in most of the electrically stressed samples, fracture occurred at the interface region between the solder and the joining metals. The critical current density that caused brittle fracture was about 2 9 10 3 A/cm 2 . Once brittle fracture occurred, the tensile toughness, defined as the energy per unit fractured area, was usually lower than $5 kJ/m 2 , compared with the case of ductile fracture where this value was typically greater than $9 kJ/m 2 . When comparing the two types of joint, the brittle failure was found to be more severe with the Ni than with the Ni-P joint. This work also found that the passage of electric current affects the IMC growth rate more significantly in the Ni than in the Ni-P joint. In the case of the Ni joint, the Ni 3 Sn 4 IMC at the anode side was appreciably thicker than that formed at the cathode side. However, in the case of electroless Ni-P metallization, this difference was much smaller.

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“…Most previous results have reported that this phenomenon deteriorates the interfacial mechanical properties with increasing thickness of the IMC layers. [5][6][7] However, for some solder joints, increasing thickness of the IMC layers is not the sole reason for the decrease in mechanical properties; for example, the formation of the Cu 3 Sn layer and voids at the interface can also strongly deteriorate the mechanical properties of the solder joints.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples

Zou

Zhang

2011

Journal of Elec Materi

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In the current study, the interfacial microstructures of Sn-Ag/Cu-X alloy (X = Ag, Sn or Zn) couples were investigated. The experimental results confirm that addition of Ag or Zn can effectively suppress the growth of the Cu 3 Sn layer, while addition of Sn accelerates the growth of the Cu 3 Sn layer. Meanwhile, the formation of voids is effectively suppressed by alloying the Cu substrate. The disappearance of voids and the absence of the Cu 3 Sn layer were well explained in terms of the phase diagram and the diffusion flux: the Cu 3 Sn phase is a nonequilibrium phase based on the Sn-Cu-Zn ternary phase diagram, since a high-Zn region is formed at the Cu 6 Sn 5 /Cu-Zn alloy interface; in addition, the high Sn diffusion flux in the Cu 6 Sn 5 can suppress the growth of Cu 3 Sn and the formation of voids.

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Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad

Cited by 14 publications

References 14 publications

Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints

Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples

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