Effect of reflow time on shear property of two-step electroplated Sn-3.5Ag solder bumps

Zhao, Qinghua; Bi, Jinglin; Hu, Anmin; Li, Ming; Mao, Dali

doi:10.1109/icept-hdp.2012.6474827

Cited by 1 publication

(1 citation statement)

References 13 publications

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“…1,2 The harmful effects of Pb on the environment and health have promoted development of lead-free solders, such as the Sn-Ag, Sn-Cu, Sn-AgCu, and Sn-Bi systems. [3][4][5][6][7][8] Among them, Sn-Bi alloys are attractive as solder alloys due to their low melting temperature, low cost, and good mechanical properties, such as tensile strength and creep resistance, compared with Sn-Pb alloy. [9][10][11] In particular, Sn-58 wt.%Bi alloy with eutectic composition has low melting temperature of 138°C, showing that it is possible to reflow at low processing temperature.…”

Section: Introductionmentioning

confidence: 99%

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung

Kim

et al. 2016

Journal of Elec Materi

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The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/ 85% RH storage condition, new IMCs were formed on the Ni 3 Sn 4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

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