1990
DOI: 10.1557/jmr.1990.0776
|View full text |Cite
|
Sign up to set email alerts
|

Effect of residual stress and adhesion on the hardness of copper films deposited on silicon

Abstract: Continuous indentation testing was used to measure the hardness as a function of indentation depth, of three micron thick copper films deposited on silicon with an intermediate layer of 20 nm thick chromium or titanium. Three different indenters, a nearly perfect Vickers, a Vickers with a 1.2 £im2 flat, and a Pyramid with a 25 ^.m2 flat were employed. The hardness data suggest that the titanium interlayer produced significantly greater film/substrate adhesion than the chromium interlayer. A compressive residua… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
8
0

Year Published

1993
1993
2017
2017

Publication Types

Select...
5
3
2

Relationship

0
10

Authors

Journals

citations
Cited by 62 publications
(8 citation statements)
references
References 8 publications
0
8
0
Order By: Relevance
“…A recent study by LaFontaine et al 20 involving Vickers indentation supported this view. According to Mott19 this piled-up material supports little or no load.…”
Section: The Effect Of Displaced Materialsmentioning
confidence: 84%
“…A recent study by LaFontaine et al 20 involving Vickers indentation supported this view. According to Mott19 this piled-up material supports little or no load.…”
Section: The Effect Of Displaced Materialsmentioning
confidence: 84%
“…In the past, several investigations dealing with the influence from in-plane residual stresses on the results given by a sharp indentation test have been presented, cf. e. g. Lafontaine et al [59]. The basic features of the problem were not fully understood, however, until Tsui et al [58] and Bolshakov et al [56] investigated, by using nano-indentation as well as numerical methods, the influence of applied stress on hardness, contact area and apparent elastic modulus at indentation of aluminum alloy 8009.…”
Section: Differences and Similarities Between Cone And Pyramid Indentmentioning
confidence: 99%
“…4 Numerous studies have since been conducted to examine the relationship between hardness measurement and residual stress. [5][6][7][8][9][10][11][12] In general, hardness decreases with tensile stress and increases with compressive stress, although the effects of compression are often not as large as tension and sometimes not observed. These phenomena are qualitatively explained by simple principles of plasticity.…”
Section: Introductionmentioning
confidence: 99%