2011
DOI: 10.1007/s00542-011-1360-5
|View full text |Cite
|
Sign up to set email alerts
|

Effect of residual stress on RF MEMS switch

Abstract: Studies have been carried out on a RF MEMS shunt switch to analyze the effect of residual stress on its electromechanical characteristics. This paper presents the simulated results as well as theoretically calculated results of a shunt switch due to the presence of residual stress gradient in respect of resonant frequency, pull down voltage and switching characteristics. The effect of introduction of holes in the beam is also studied. The calculated results, corresponding to the switch (without holes) at zero … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
7
0
2

Year Published

2013
2013
2020
2020

Publication Types

Select...
7
1
1

Relationship

1
8

Authors

Journals

citations
Cited by 36 publications
(9 citation statements)
references
References 12 publications
0
7
0
2
Order By: Relevance
“…It affects the flatness of the fabricated switch, thus affecting the static and dynamic characteristics of the switch. For example, the compressive stress increases the pull-in voltage and reduces the switching time [ 65 ]. Temperature is the most common failure acceleration factor.…”
Section: Performance Indicators Of Mems Switchesmentioning
confidence: 99%
“…It affects the flatness of the fabricated switch, thus affecting the static and dynamic characteristics of the switch. For example, the compressive stress increases the pull-in voltage and reduces the switching time [ 65 ]. Temperature is the most common failure acceleration factor.…”
Section: Performance Indicators Of Mems Switchesmentioning
confidence: 99%
“…Although a high natural frequency may also lead to an increased switch-on time, the shape mode of the beam is not useful for RF MEMS switches. The relation between the switching time and the natural frequency of MEMS switch is given as bellow [24].…”
Section: Mechanical Parametersmentioning
confidence: 99%
“…Residual stress is one of the most common after-effects of the thin film deposition process and so associated with MEMS structures [12][13][14]. Residual stresses can be described in terms of length over which the stresses equilibrate [15][16][17].…”
Section: Introductionmentioning
confidence: 99%