Effect of Sb addition on Bi–2.6Ag–0.1Cu solders for high-temperature applications

Kim, Beom-Jun; Lee, Chang-Woo; Lee, Dong−Yun; Kang, Nam Jun

doi:10.1016/j.jallcom.2013.12.252

Cited by 31 publications

(14 citation statements)

References 19 publications

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“…It was 6 revealed that the addition of Sn to Bi-Ag eutectic improves its wetting on copper. The data on wetting of Cu by Bi-rich Bi-Ag alloys are limited [6][7][8][9] and differ with respect to reported values of the wetting angle. One important factor affecting quality of the joint, in particular its mechanical properties, is the structure of connection at the interface.…”

Section: Introductionmentioning

confidence: 58%

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Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

Fima

Garzeł

Sypień

2014

Journal of Elec Materi

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The phase equilibrium in the Ag-Bi-Cu system was experimentally determined at 573 K, 773 K, and 973 K by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) on annealed alloys and liquid/solid couples. The experimental results indicate that the mutual solubility of the components is limited. Based on the present results and literature data, phase equilibria in the Ag-Bi-Cu system were thermodynamically assessed. Wetting of Bi-2.6Ag-xCu alloys on Cu substrates was studied with the sessile drop method in the presence of flux at 573 K and 623 K. It was found that the wetting to non-wetting transition corresponds to the solubility limit of Cu in liquid. Selected solidified solder-substrate couples were cross-sectioned and their interfacial microstructure examined with SEM-EDS. There are no reaction products at the interface, but the copper surface becomes rough because of dissolution by liquid solder.

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Section: Introductionmentioning

confidence: 58%

“…In the case of Bi-Ag-xCu alloys, wettability data are limited. 6,8,9 In Ref. 8, the wetting angle of 40°w as reported for Bi-2.5Ag/Cu, after wetting at 613 K for 60 s, but no information on the flux used (if any) was provided.…”

Section: Thermodynamic Model and Assessmentmentioning

confidence: 99%

Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

Fima

Garzeł

Sypień

2014

Journal of Elec Materi

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“…However, due to a recent environmental regulation for automobiles, i.e., End-of-Life Vehicle (ELV), the use of Pb-containing solders for electrical components was completely prohibited in the European Union (EU), the European Free Trade Association (EFTA), Japan, Korea, and China. Therefore, studies on high-temperature Pb-free solder to substitute for conventional Pb-containing solder have been conducted [5][6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

Park

Bang

et al. 2017

Metals

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Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 • C under driving conditions. Therefore, it is necessary to study the high-temperature reliability of solder joints. This study investigated the creep properties of Sn-3.0Ag-0.5Cu (SAC305) and Sn-8.0Sb-3.0Ag (SSA8030) solder joints. The creep test was conducted at 175 and 190 • C with the application of 2.45 MPa. The SAC305 solder had superior creep properties to those of SSA8030 solder at 175 • C and at largely the same homologous temperature (T H~0 .91 for SAC305 and T H~0 .92 for SSA8030). Both solders had primary β-Sn and a eutectic mixture of β-Sn and Ag 3 Sn. Compared to SSA8030, the SAC305 solder contained~10% more eutectic structure and contained Ag 3 Sn that was 3 times smaller and more round in shape. Furthermore, the SSA8030 solder precipitated SnSb in an elongated fiber shape (1-50 µm in size) after the creep test. Coarse and elongated Ag 3 Sn and SnSb of the SSA8030 solder negatively affected crack propagation in the dislocation creep region and decreased the creep resistance.

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“…Now, lead-free high-melting point solder is not regulated by RoHS restriction yet, but such lead-free solder is expected to be developed [1][2][3][4][5] . Pb-(5-10 mass%)Sn solder, however, are still considered the material of choice for high temperature applications due to the inherent limitations of Pb-free solders, including wettability, reliability, and cost 6) . Given these considerations, Au-based, Zn-based, and Bibased high temperature solder have been found to be suitable to satisfy the abovementioned conditions.…”

Section: Introductionmentioning

confidence: 99%

Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder

et al. 2016

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Tensile properties of three Bi-based lead-free solder which are pure Bi, Bi-1.0Ag-0.3Sn-0.03Ge (mass%), and Bi-2.5Ag (mass%) were investigated and compared with that of Pb-rich Pb-2.5Ag-2.5Sn (mass%) solder. Tensile strength of pure Bi is the minimum among solder investigated regardless of the temperature and strain state. Although tensile strength of Bi-based solder is lower than that of Pb-2.5Ag-2.5Sn at 25 C, those of Bi-1.0Ag-0.3Sn-0.03Ge and Bi-2.5Ag improve and become analogous and higher than that of Pb-2.5Ag-2.5Sn at a temperature of 125 C or more. The effect of strain rate on elongation is negligible in solder investigated. Although elongations of Bi-based lead-free solder are lower than that of Pb-2.5Ag-2.5Sn at 25 C, they increase with increasing temperature. While the elongation of Pb-2.5Ag-2.5Sn relatively stable at approximately 20-30% regardless of temperature, elongations of Bi-1.0Ag-0.3Sn-0.03Ge and Bi-2.5Ag become a same level with that of Pb-2.5Ag-2.5Sn at 125 C and 175 C. In particular, the ductility of pure Bi which is about 5% improves drastically at temperatures of 75 C or more and the elongation rises to approximately 60%. From microstructure observation results, it was con rmed that the addition of small amount of Sn and Ge is effective to form ne microstructure. From fracture surface observation results, it was con rmed that brittle fracture occurs at 25 C and the fracture mode changes to ductile fracture when the temperature increases and the ductility improves.

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Effect of Sb addition on Bi–2.6Ag–0.1Cu solders for high-temperature applications

Cited by 31 publications

References 19 publications

Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder

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