Effect of SiC particle morphology on Co–P electroless coating characteristics

Noori, Hadi; Mousavian, R. Taherzadeh; Khosroshahi, R. Azari; Brabazon, Dermot; Damadi, S. R.

doi:10.1179/1743294415y.0000000035

Cited by 11 publications

(6 citation statements)

References 25 publications

(36 reference statements)

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“…A good distribution of micron-particles was obtained in our previous studies by using various wettability improvement methods such as interfacial-active element addition by ball milling of ceramic powders with Al and Mg powders [19] and electroless deposition of Ni-P [25], Cu [26], and Co [27,28] on the ceramics. In these cases, improved strength and hardness were obtained for the micron-SiC p/Al composites compared with the unreinforced Al alloys, while a signifi-cantly reduced ductility limits their widespread application.…”

Section: Introductionmentioning

confidence: 83%

Fabrication of aluminum matrix composites reinforced with nano- to micrometer-sized SiC particles

et al. 2016

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ab s t r a c tIn this study, the hot extrusion process was applied to stir cast aluminum matrix-SiC composites in order to im-prove their microstructure and reduce cast part defects. SiC particles were ball milled with Cr, Cu, and Ti as three forms of carrier agents to improve SiC incorporation. Large brittle ceramic particles (average particle size: 80 μm) were fragmented during ball-milling to form nanoparticles in order to reduce the cost of composite manufactur-ing. The experimental results indicate that full conversion of coarse micron sized to nanoparticles, even after 36 h of ball milling, was not possible. Multi modal SiC particle size distributions which included SiC nanoparticles were produced after the milling process, leading to the incorporation of a size range of SiC particle sizes from about 50 nm to larger than 10 μm, into the molten A356 aluminum alloy. The particle size of the milled powders and the amount of released heat from the reaction between the carrier agent and molten aluminum are inferred as two crucial factors that affect the resultant part tensile properties and microhardness.

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Section: Introductionmentioning

confidence: 83%

Fabrication of aluminum matrix composites reinforced with nano- to micrometer-sized SiC particles

et al. 2016

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“…[140,142] Using electroless plating technique, SiC particles have been successfully coated with different metal likes copper, nickel, and cobalt for use as reinforcement particles with improved wettability. [143][144][145][146] Even the coating of nanoparticles has been reported. [147] Despite the advantages of coated reinforcement over the uncoated ones in MMCs, [140] uneven dispersion of reinforcement particles may still remain a critical issue and a drawback to wider commercialization of MMCs.…”

Section: A Perspective On Tailor Designing Powder Feedstock For Mmcs ...mentioning

confidence: 99%

Issues in Metal Matrix Composites Fabricated by Laser Powder Bed Fusion Technique: A Review

Essien

Vaudreuil

2022

Adv Eng Mater

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Technologies for the additive manufacturing (AM) of metals have progressed throughout the years, with significant improvements in both quality of AM components and wider scale application. In just about every current application for powder bed fusion (PBF) processes, the powders used are alloys of base metals like aluminum, iron, nickel, cobalt, and titanium, with a chemistry sometimes adapted to enable their processing by a laser-based system. While the current state of development enables the production of parts for demanding industries such as aerospace, a new class of materials such as metal matrix composites (MMCs) could enhance further applications of AM-fabricated metallic parts. MMCs combine a metallic powder with a reinforcing agent, a ceramic powder being the most commonly used. These powders can be mixed, blended, or mechanically alloyed together into a composite powder, before being consolidated layer-by-layer into the designed part. [1] This part will exhibit reinforcement particles dispersed within the bulk metal matrix. The MMCs development thus needs to achieve enhanced properties through a compromise between tenacity of the matrix and the rigidity of reinforcing particles. Figure 1 shows a schematic of processed MMC and its processing steps.The PBF process uses a high energy laser to fuse powder particles into a near net shape component. Combining different parameters (preprocessing, processing, etc.) to produce a fully dense part in AM is, however, a complex process. The consolidation process involves multiple phenomena such as heating (thermal expansion), melt pool formation, solidification, and cooling (thermal contraction), all of which occur simultaneously and in a repeated manner. [2,3] This process complexity is increased significantly when trying to attain fully dense MMC from metal and ceramic. Multiple reasons are involved, ranging from the raw materials used to interactions between laser and powder. A segregation of dissimilar materials found in the composite powder (mixed powder system) can arise on the build platform during feeding. [4] This would create issues of particles clustering and uneven dispersion, encouraging further defects formation.The capability of fabricating fully dense components with desired properties (mechanical, electrical, etc.) and less defects in AM has been the focus of researchers and industries. [5] However, inherent defects like porosities and surface roughness in AM parts remain a challenge. Various factors related to AM machines, material properties, and processing parameters are responsible for these defects.Processing parameters influence the overall quality of AM parts by influencing temperature gradients, consolidation and solidification, thermal-induced stresses as well as the susceptibility of PBF-processed part to defects. Changes in powder chemical composition can influence consolidation and defect generation. [6,7] Proper considerations must, thus, be given in understanding, predicting, and preventing defects in PBF-processed

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“…The process of electroless coating is well known and can deposit metals and metal-alloy coatings on a variety of metallic and non-metallic substrates [1][2][3]. This technique can be also used for the synthesis of different composite coatings as well as for the metallisation of nanotubes and nanowires [4][5][6][7][8][9]. A typical example is electroless nickel phosphorus coating (EN-P) which has attracted particular interest due to its unique qualities, such as high hardness and outstanding abrasion, wear and corrosion resistance [5,10].…”

Section: Introductionmentioning

confidence: 99%

Modelling of surfactants and chemistry for electroless Ni-P plating

Farzaneh

Ehteshamzadeh

Cobley

2018

Surface Engineering

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In this work, the effects of the chemical formulation in an electroless nickel phosphorus electrolyte on the physical and mechanical performance of the obtained coating were evaluated. The study paid particular attention to the concentration and type of surfactant (anionic, cationic and nonionic) but also investigated the effect of pH and concentration of sodium hypophosphite in the electrolyte. A three-level Box-Behnken factorial design related to response surface methodology was employed to model the effect of the mentioned parameters and optimize the properties of the coating. Two models fitted with experimental data obtained from microhardness and thickness measurement of the Ni-P coatings. The optimum conditions were determined at pH=5 with 32 g/L sodium hypophosphite and 1.5 g/L anionic surfactant. According to the derived models this formulation would give a Ni-P coating with microhardness of 1080 Hv and thickness of 23 µm.

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Effect of SiC particle morphology on Co–P electroless coating characteristics

Cited by 11 publications

References 25 publications

Fabrication of aluminum matrix composites reinforced with nano- to micrometer-sized SiC particles

Fabrication of aluminum matrix composites reinforced with nano- to micrometer-sized SiC particles

Issues in Metal Matrix Composites Fabricated by Laser Powder Bed Fusion Technique: A Review

Modelling of surfactants and chemistry for electroless Ni-P plating

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