2014
DOI: 10.1007/s11665-014-1103-8
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Effect of Silicon on the Thixoformability of Al-Si-Cu Alloys

Abstract: The thixoformability of new Al-Si-Cu alloys was evaluated and characterized by their microstructural and rheological behavior. Alloys Al1Si2.6Cu, Al2Si2.6Cu, Al4Si2.6Cu, and Al7Si2.6Cu were produced with the addition of Al5Ti1B grain refiner alloy. The materials were heat treated under two controlled conditions: holding times of 0, 30, 90, and 210 s and solid fraction of 45 and 60%. The evaluation of the microstructure and semisolid behavior was characterized by globule size, shape factor (SF), minimum stress … Show more

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Cited by 7 publications
(4 citation statements)
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“…Based on Liu et al 's theory [7], recent studies have been focused on the evaluation the thixoformability through processing temperature and modifying alloy elements [8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…Based on Liu et al 's theory [7], recent studies have been focused on the evaluation the thixoformability through processing temperature and modifying alloy elements [8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…The apparent viscosity (l) and average shear rate (_ c) were obtained according to Eqs. [5] and [6], respectively.…”
Section: Hot Compression Testsmentioning
confidence: 99%
“…[5] Among these techniques, chemical grain refinement by the addition of elements such as Ti and B is advantageous compared with the traditional routes as it does not require any specific equipment to obtain an equiaxial microstructure, resulting in a simple and cheap technique for obtaining a good-quality semi-solid material. [6] One of the issues related to the grain refinement technique in aluminum alloys is the poisoning effect of Si, where Si levels > 3 pct decrease the effect of the refining elements. [7] Several studies have been conducted trying to overcome this effect.…”
Section: Introductionmentioning
confidence: 99%
“…Figura 4 -Microestruturas obtidas pelas diversas rotas de processamento: (a, b) liga Al7Si2.6Cu (similar à liga A356) processada via refi no de grãos reaquecida à temperatura semissólida de 580 °C (BENATI et al, 2014), (c, d) liga A356 processada via agitação mecânica, (e, f) liga A356 processada via agitação eletromagnética, (g, h) liga A356 processada via ECAP reaquecidas à temperatura semissólida de 580 °C (CAMPOS et al, 2013) e (i, j) liga A355 processada via refi no de grãos por ultrassom reaquecida à temperatura semissólida de 595 °C (DE PAULA et al, 2018).…”
Section: Matéria-prima Processada Matéria-prima Reaquecidaunclassified