Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024‐T6 alloy

Ghaznavi, Majid Mahmoudi; Ekrami, A.; Kokabi, A.H.

doi:10.1179/1362171810y.0000000013

Cited by 12 publications

(10 citation statements)

References 20 publications

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“…where l max is the maximum thickness of the liquid interlayer region at the end of widening and homogenization, D is the diffusion coefficient of the liquid interlayer in solid substrate, K is the constant which can be derived from Lesoult's demonstration. 8 In this case of TLP diffusion bonding, it has been shown D (the diffusivity of Cu) was increased with increasing bonding temperature then resulted t IS for bonding was decreased. In this study, with using nanostructured structure that resulting short isothermal solidification time because diffusion time depends on the grain size.…”

Section: Microstructure Of Jointmentioning

confidence: 78%

“…As a result, these particles are accumulated in grain boundaries and in centreline of bonding zone in which the last stage of isothermal solidification specially occurs. 8 The results indicated that the width of the Al 2 O 3 particles concentration at the interface increased to approximately twice as the bonding temperature was increased from 550 to 610uC. This was attributed to an increase in the diffusivity of Cu from the interface into the base metal as the bonding temperature increased.…”

Section: Microstructure Of Jointmentioning

confidence: 91%

“…The diffusion controlled isothermal solidification stage of TLP diffusion bonding consists of a process that involves a moving solid-liquid interphase boundary. As was stated earlier, several models have been developed and proposed for estimating the time (t IS ) required completing isothermal solidification based on the solution of Fick's second law 8 and the complete time for isothermal solidification t IS is given by 8…”

Section: Microstructure Of Jointmentioning

confidence: 99%

See 2 more Smart Citations

Transient liquid phase diffusion bonding of Al/Al₂O₃ nanostructured metal matrix composites

Yarahmadi

Shamanian

Jazi

et al. 2014

Science and Technology of Welding and Joining

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Transient liquid phase (TLP) diffusion bonding was carried out on nanostructured metal matrix composite sheets of Al-1100 alloy with 5 wt-% alumina particles at various bonding temperatures and process durations. A thin layer of 5 mm pure copper was electrodeposited as an interlayer. Joint formation was first attributed to the solid state diffusion of copper into the aluminium metal matrix followed by eutectic formation; then, base metal dissolution and isothermal solidification was completed at the joint interface. Joint area was characterised using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Diffraction patterns showed the formation of intermetallic phases like CuAl 2 . The concentration of Al 2 O 3 particles increases across the interface as the bonding temperature increases. As a result, the highest bond strength of 123 MPa was achieved after a bonding duration of 30 min at 590uC.

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Section: Microstructure Of Jointmentioning

confidence: 78%

Section: Microstructure Of Jointmentioning

confidence: 91%

Section: Microstructure Of Jointmentioning

confidence: 99%

See 1 more Smart Citation

Transient liquid phase diffusion bonding of Al/Al₂O₃ nanostructured metal matrix composites

Yarahmadi

Shamanian

Jazi

et al. 2014

Science and Technology of Welding and Joining

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“…As is known that the micromechanical properties are related to the solidification process. [40,41] Therefore, we detected the micromechanical properties of solid gallium at different conditions.…”

Section: Micromechanical Propertiesmentioning

confidence: 99%

Fast Solidification of Pure Gallium at Room Temperature and its Micromechanical Properties

Wang

Xiao

et al. 2022

Adv Materials Inter

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lent fluidity at room temperature, electrical and thermal conductivity, deformability in response to various stimuli, etc. Thus it has been intensively investigated in the field of thermal management, [1,2] flexible electronics and devices, [3][4][5][6][7] additive manufacture, [8,9] medical therapies, [10][11][12] soft robotics, [13,14] etc. Among the applications, the solid-liquid phase transition of gallium can enable diverse and specific functions beyond the single liquid-state metal behaviors. For instance, the phase transition of gallium-based polymer can achieve reversible transitional insulator and conductor, which can be applied as temperature-controlled electrical switches and circuits. [15] Taking advantage of the mechanical strength of solid gallium, the mechanically transformative electronics, sensors, and implantable devices can be also realized by solid-phase phase transition. [10,16] Moreover, phase transition of the liquid gallium or its alloy composite can generate reversible and strong adhesion to different surfaces, which can be used as transformable grippers for various objects. [14,13,17] During the solid-liquid phase transition, the melting process is relatively quick as temperature rises above the melting point. However, the solidification of gallium usually requires a much lower temperature than the melting point as well much longer time due to the significant supercooling effect (the With excellent electrical conductivity, fluidity, rheological property, and biocompatibility, gallium has been intensively studied in the fields of flexible electronics and devices, thermal management, and soft robotics. However, the large degree of supercooling of gallium presents a large limitation for phase transition-related applications such as the very low temperature required for solidification, the impurities, and side effects brought in by nucleating agents. In this study, solidification process of liquid gallium by using solid gallium as a nucleating agent is discovered to be fast and facile at room temperature compared with other agent materials including copper, iron, and nickel. Quantificationally, solidified gallium as a nucleating agent, can effectively reduce the supercooling degree from about 66.3 to 14.8 °C. The freezing velocity can reach to 200 mm 3 min −1 . The possible mechanism is reducing the energy barrier via adding nucleation site, allowing rapid solidification at room temperature accompanying heat dissipation. Moreover, micromechanical properties are compared between raw solid Ga and the solidified Ga induced by Ga agent, which suggests a slight decrease in mechanical strength at room temperature with the nucleating agent. It will be beneficial to understand the phase change and also provide guidance for the application of gallium regarding its mechanical properties.

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“…It can also disrupt the oxide film and has been used for flux free brazing of pure aluminium 3 and TLP bonding of aluminium alloy. 18 Referring to this work, a novel Al-Si-Cu-Ga-Ce interlayer alloy is applied for the TLP bonding of aluminium and its alloy. Compared with the present copper interlayer, the Al-Si-Cu-Ga-Ce interlayer has a lower melting point than the bonding temperature and the same main element as the aluminium substrate.…”

Section: Microstructure Evolution In Tlp Bonding Of Aluminium Alloy U...mentioning

confidence: 99%

Transient liquid phase bonding of aluminium alloy using two-step heating process

Wang

Li²,

Wang

2012

Science and Technology of Welding and Joining

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5A02 aluminium alloy was joined by transient liquid phase (TLP) bonding using the two-step heating process as follows: the faying area was first heated to 600uC and kept for 5 s and then cooled down to 595uC and kept for 3 min. The microstructure and properties of the joint were investigated and compared with that of conventional TLP bond at 595uC for 3 min. The results show that the two-step heating process can produce a wave bond line that is different from the planar interface associated with conventional TLP bonding at a constant temperature. The defects at the bond line are greatly reduced, and metal to metal contacts are established along the wave bond line using the two-step heating process. Therefore, the tensile strength and bending ductility of the joint are dramatically improved.

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Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024‐T6 alloy

Cited by 12 publications

References 20 publications

Transient liquid phase diffusion bonding of Al/Al₂O₃ nanostructured metal matrix composites

Transient liquid phase diffusion bonding of Al/Al₂O₃ nanostructured metal matrix composites

Fast Solidification of Pure Gallium at Room Temperature and its Micromechanical Properties

Transient liquid phase bonding of aluminium alloy using two-step heating process

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Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024‐T6 alloy

Cited by 12 publications

References 20 publications

Transient liquid phase diffusion bonding of Al/Al2O3 nanostructured metal matrix composites

Transient liquid phase diffusion bonding of Al/Al2O3 nanostructured metal matrix composites

Fast Solidification of Pure Gallium at Room Temperature and its Micromechanical Properties

Transient liquid phase bonding of aluminium alloy using two-step heating process

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Product

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Transient liquid phase diffusion bonding of Al/Al₂O₃ nanostructured metal matrix composites

Transient liquid phase diffusion bonding of Al/Al₂O₃ nanostructured metal matrix composites