Effect of substrates on the structure of polymer interphases

Matrix–particle interactions in catalyzed and uncatalyzed copper‐filled epoxy matrix composites

“…The peaks at the lowest binding energy, at 283.9 eV and 284.2 eV in the uncatalyzed and catalyzed samples, respectively, are attributed to the C (1 s) core level of the aromatic ring, while the peak at 284.5 eV is attributed to CH bonds and elemental carbon . The peaks at 285.3 eV and 285.5 eV are attributed to CO, aliphatic CH, and CC, and those at 287.9 eV and 288.0 eV are attributed to carbon in a metal carboxylate with some influence of OCO bonds . The main difference observed between both composites would be the increase in the last peak mentioned from the catalyzed to the uncatalyzed sample.…”

“…The satellite peak at 944 eV indicates unequivocally the presence of cupric compounds . The deconvolution of the main peak, considering three peaks, would indicate the presence of Cu 2 O associated with 932.3 eV for both samples, with a possible influence of metallic copper (932.7 eV) or some complex of Cu(I) with organic molecules . The peak at 933.6 eV is attributed to CuO, and the one located at the highest energy (934.2 eV and 934.7 eV for the uncatalyzed and catalyzed samples, respectively) would be associated with complexes of Cu(II).…”

“…However, the changes between both spectra were analyzed by taking into account the assignments for the main peaks expected for Cu (335 eV), CuO (336 eV), and Cu 2 O (337.2 eV), named peak 1, 2, and 3, respectively, in Figure . On the other hand, two peaks, at 338.1 eV (peak 4) and 339.1 eV (peak 5), can be associated with copper complexes . Boerio and Ondrus identified Cu(I) salt of nadic methyl anhydride at 339.1 eV in the Auger spectrum of a cured sample, and a Cu(II) complex at 338.1 eV (peak 4) in the spectrum of a film of anhydride on copper.…”

“…Some studies of epoxy systems cured on copper substrates have been reported . An effect produced by copper complexes and copper oxides on the curing reaction of the epoxy has been found . In general, metal complexes were observed when the epoxy–diamine hardener system was put in contact with metal, forming crystallites or reacting with the epoxy .…”

The effect of surface roughness on the adhesion properties of ceramic / hybrid FRP adhesively bonded systems

“…The mechanical property of ceramic/FRP bonded systems using adhesives is affected by the interfacial property between the adhesive and the two substrates, especially by the interface between the adhesive and the FRP substrate which has a surface free energy lower than that of the ceramic. In order to improve the interfacial adhesion strength of ceramic/FRP bonded systems, a variety of substrate modifications, such as surface roughening, primer treatment, and plasma treatment, have been developed [12][13][14]. Among others, the surface roughness of the FRP substrate caused by mechanical abrasion leads to a mechanical interlocking phenomenon between the adhesive and the FRP substrate, which results in a high joint strength of ceramic/FRP bonded systems.…”