Effect of Target Composition and Sputtering Deposition Parameters on the Functional Properties of Nitrogenized Ag-Permalloy Flexible Thin Films Deposited on Polymer Substrates

Abstract

We report the first results of functional properties of nitrogenized silver-permalloy thin films deposited on polyethylene terephthalic ester {PETE (C10H8O4)n} flexible substrates by magnetron sputtering. These new soft magnetic thin films have magnetization that is comparable to pure Ni81Fe19 permalloy films. Two target compositions (Ni76Fe19Ag5 and Ni72Fe18Ag10) were used to study the effect of compositional variation and sputtering parameters, including nitrogen flow rate on the phase evolution and surface properties. Aggregate flow rate and total pressure of Ar+N2 mixture was 60 sccm and 0.55 Pa, respectively. The distance between target and the substrate was kept at 100 mm, while using sputtering power from 100–130 W. Average film deposition rate was confirmed at around 2.05 nm/min for argon atmosphere and was reduced to 1.8 nm/min in reactive nitrogen atmosphere. X-ray diffraction, X-ray photoelectron spectroscopy, scanning electron microscopy, vibrating sample magnetometer, and contact angle measurements were used to characterize the functional properties. Nano sized character of films was confirmed by XRD and SEM. It is found that the grain size was reduced by the formation of nitride phase, which in turns enhanced the magnetization and lowers the coercivity. Magnetic field coupling efficiency limit was determined from 1.6–2 GHz frequency limit. The results of comparable magnetic performance, lowest magnetic loss, and highest surface free energy, confirming that 15 sccm nitrogen flow rate at 115 W is optimal for producing Ag-doped permalloy flexible thin films having excellent magnetic field coupling efficiency.

Lattice-Match Stabilization and Magnetic Properties of Metastable Epitaxial Permalloy-Disilicide Nanostructures on a Vicinal Si(111) Substrate

“…It is broadly accepted that the binding 2p 3/2 energy of metallic Ni 0 is 852.6 eV, with two main satellites located 3.8 eV and 6 eV above that [ 41 , 42 , 43 ]. However the 2p 3/2 binding energy can rise above 853 eV in permalloys and other binary and ternary alloys and compounds [ 42 , 44 , 45 ], and in particular values close to those observed here of 853.61 eV, reflect the effect of the Si environment [ 46 ]. No significant presence of higher oxidation states of Ni 2+ and Ni 3+ oxides and hydroxides, situated at binding energies of 854 eV and above [ 47 ], could be detected in the Ni 2p 3/2 line shown in Figure 2 b.…”

Sputtering onto a liquid: interesting physical preparation method for multi-metallic nanoparticles

“…The sputtering technique, therefore, is widely used for thin film deposition, surface coating, and surface etching applications [3,4]. As a conventional approach for producing thin film and multiple layers of metals, metal alloys, and metal oxides the method still received significant studies until now [5][6][7][8][9][10][11][12][13][14][15][16]. To some extent, the technique has been also used for immobilizing nanoparticles (NPs) on a solid substrate [17][18][19][20][21][22], or decorating nanoparticles on other metal/oxides nano-micron particles as the supporters [23][24][25][26][27][28][29][30][31][32][33].…”

Effects of a cathode fall region on deposition rate of copper atoms in Dc plasma sputtering source

“…Sputtering plasma sources have been widely used in several research and applied fields such as, coating processes and thin films production [1][2][3][4]. There are several parameters affecting the quality and properties of the thin films and the coating processes produced in this way, including the type of material to be deposited, the shape of the electrodes, the dimensions of the source, the operating conditions and the type of plasma [5][6][7][8][9].…”