Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn–0.7Cu solder alloy and copper substrate

Satyanarayan,; Prabhu, K. Narayan

doi:10.1007/s10854-012-0644-6

Cited by 13 publications

(7 citation statements)

References 15 publications

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“…Tensile tests were performed at room temperature 5 (25 o C) with a constant strain rate of 1.6 × 10 -2 s -1 . The tensile direction was parallel to the crystal growth direction (the axis of the rod).…”

Section: Tensile Testsmentioning

confidence: 99%

“…The eutectic Sn0.7Cu solder is considered one of the most popular solders for surface mount technology (SMT) or wave soldering due to their superior properties such as: low-cost, prohibiting dissolution of Cu substrate and availability, especially for iron, dip and wave soldering operations [4][5][6][7][8][9]. The melting point of eutectic composition is relatively high (227 •C) when compared to the Sn-Pb solder alloy (183 • C) [10].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Liu

et al. 2015

Journal of Alloys and Compounds

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Section: Tensile Testsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Liu

et al. 2015

Journal of Alloys and Compounds

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“…Wettability of the Sn-0?7Cu solder is consistent with our previous work. 15 The height and thickness of needle shaped IMCs were 88 mm and 6 mm, respectively, for the Sn-0?7Cu solder alloy solidified on smooth Cu surface.…”

Section: Methodsmentioning

confidence: 94%

Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Satyanarayan

Prabhu

2013

Materials Science and Technology

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The bond shear test was used to assess the integrity of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloy drops solidified on copper substrates with smooth and rough surface finishes. Solder alloys solidified on smooth substrates required higher shear force compared to that on rough substrates. Sn–0·3Ag–0·7Cu alloy required higher shear energy than Sn–0·7Cu alloy. Solder alloys solidified on smooth substrate surfaces exhibited complete ductile failure. On rough copper surfaces, solder alloys showed a transition ridge characterized by sheared intermetallic compounds (IMCs) and the presence of dimples. The peak shear strength decreased with increase in contact area of the solder bond on the substrate. Smooth surface and the presence of minor amount of Ag in the solder alloy enhance the integrity of the solder joint.

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“…The solder and flux influenced the wettability of solder paste. The wettability was determined using an intermetallic compound (IMC) that formed Cu 6 Sn 5 between the Sn-58Bi melting solder and the Cu substrate [21,22]. Meanwhile, the flux improved the wettability mainly by removing the oxide film on the surface of the Cu substrate, reducing the surface tension and preventing reoxidation.…”

Section: Spreading Performance Of Solder Pastementioning

confidence: 99%

Mechanical Property of Sn-58Bi Solder Paste Strengthened by Resin

2018

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Sn-58Bi solder has been widely used for microelectronics packaging due to its low melting point temperature, good wetting performance, good mechanical properties, and low cost. Compared with Sn-Bi solder alloy and Sn-Pb solder alloy, the strength and plasticity of Sn-Bi solder are not enough, due to the higher brittleness of bismuth, which thus limits the application of Sn-Bi solder. In order to improve the properties of Sn-Bi solder, a novel solder paste strengthened with resin was developed by mixing epoxy resin (ER) with Sn-58Bi solder, which enhanced the joint strength at a low cost. Aimed at the electronic industry, in this study, the spreadability of the novel solder paste was investigated, and the mechanical properties and microstructure of solder joints after reflow soldering were tested and analyzed. The results showed that when the content of epoxy resin was in the optimum range, the shear strength was significantly higher, reaching nearly twice that of Sn-58Bi solder alone.

show abstract

Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn–0.7Cu solder alloy and copper substrate

Cited by 13 publications

References 15 publications

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Mechanical Property of Sn-58Bi Solder Paste Strengthened by Resin

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