Summary
In recent years, the laser half‐cutting technology for silicon solar cells has gotten much attention from researchers for increasing module power and would become particularly important in the photovoltaic modules domain. Herein, this paper would introduce a kind of new laser cutting process, a thermal laser separation (TLS) cutting technology. In the laser cutting processes, the influence on mechanical and electrical characteristics of bifacial p‐type passivated emitter and rear (PERC) solar cell and module were investigated in considerable detail. We have made a series of research and analyses including the cutting principle, opening length, fracture surface, and hot influence zone. The results reveal that the TLS cutting process could reduce damage more than the regular laser scribing and cleaving (LSC) cutting process. The TLS cutting process would achieve the higher power of a PERC half‐cutting bifacial module and the stronger bending strength of half solar cells than the LSC cutting process.