Effect of temperature on shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints

Jeong, Min-Seong; Lee, Donghwan; Yoon, Jeong‐Won

doi:10.1016/j.jallcom.2022.163987

Cited by 10 publications

(2 citation statements)

References 19 publications

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“…As the strength of the solder decreases with increasing temperature, [23][24][25] once the damage in the solder joint increases to a certain degree, the resistance heat induced by the current will cause the temperature of the solder joint to reach the "softening temperature." It should be noted that the temperature of the solder joints at the later stage of the T-E coupling tests in this study were much higher than in previous reports.…”

Section: T-e Coupling Damage Mechanisms and The Influence Of Temperaturementioning

confidence: 99%

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Zhang,

An,

Song

2024

J. Electron. Mater.

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In this study, in situ investigation of the coupling damage mechanisms of SnAgCu/Cu solder joints under thermal cycling and current was carried out to compare the thermal fatigue under the same temperature range, and to analyze the influence of temperature. It was found that the current increased the temperature of the solder joint, making it obviously higher than the ambient temperature. On the other hand, there was little difference between the thermal-electrical coupling damage and thermal fatigue before a significant increase in solder temperature; the interfacial plastic deformation was only slightly more serious, and the electromigration was not significant. With an increasing number of thermal cycles, the damage, resistance, and temperature of the solder joint increased, and the plastic deformation resistance of the solder decreased, leading to further damage and temperature increase, exhibiting an accelerating damage process. After the temperature reached a certain degree, the solder softened significantly, and its deformation behavior was similar to that of high-viscosity fluids, resulting in surface unevenness with significant height differences. As the temperature of the solder joint increased, the electromigration of Cu in the solder gradually increased, and the migration rate was dominated by the solder grain orientation. With higher peak temperature of the ambient thermal cycle, the thermal cycling-electric current coupling damage rate increased substantially.

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Section: T-e Coupling Damage Mechanisms and The Influence Of Temperaturementioning

confidence: 99%

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Zhang,

An,

Song

2024

J. Electron. Mater.

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“…Similar findings are documented in the existing literature. Jeong et al [43] investigated the temperature's influence on the shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints. For Sn-3.0Ag-0.5Cu solder, escalating temperature led to decreased shear force, increased fracture distance, and diminished fracture energy.…”

Section: Correlation Between Microstructure and Mechanical Reliabilitymentioning

confidence: 99%

Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications

Kim,

Cheon,

et al. 2024

Electronics

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In this study, a novel composite solder, Sn-3.5Ag-10.0Co, was tailored for transient liquid phase (TLP) bonding in electric vehicle power module integration. Employing a meticulous two-step joining process, the solder joint was transformed into a robust microstructure characterized by two high-melting point intermetallic compounds, Ni3Sn4 and (Co,Ni)Sn2. After 1 h of TLP bonding, the Sn-3.5Ag-10.0Co paste transformed into the IMCs, but voids persisted between them, particularly between (Co,Ni)Sn2 and Ni3Sn4. Voids significantly reduced after 2 h of bonding, with full coalescence of the joint microstructure observed. The joint continued to be densified after 3 h of TLP bonding, but voids tended to accumulate at the joint center. Failure analysis revealed crack propagation through Ni3Sn4/(Co,Ni)Sn2 interfaces and internal voids. The engineered Sn-Ag-Co TLP joint exhibited superior shear strength retention even at an elevated temperature of 200 °C, contrasting with the significant reduction observed in the Sn-3.5Ag control specimen due to remaining Sn.

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Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point

Gao

Liu

Wang

2023

J Mater Sci: Mater Electron

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Effect of temperature on shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints

Cited by 10 publications

References 19 publications

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications

Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point

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