2019
DOI: 10.1080/2374068x.2019.1622298
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Effect of thermal annealing on the structural, optical and microstructural properties of a-SiC thin films

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Cited by 2 publications
(2 citation statements)
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“…Owing to the rearrangements of atomic grains, the thermal annealing of SiC above 900 K leads to compressive stress reduction, increased mechanical stability, and adhesion, as well as lower optical band gap (higher solar absorption). [ 36,37 ] In our case, SiC also acts as the diffusion barrier, [ 38 ] and prevents the oxidation or diffusion of tungsten nanoclusters at higher temperatures. The as‐deposited ultrathin SiC‐W absorptive stack on tungsten layer maintained its outstanding optical performance after annealing at 1050 K in vacuum, and 900 K in air.…”
Section: Resultsmentioning
confidence: 99%
“…Owing to the rearrangements of atomic grains, the thermal annealing of SiC above 900 K leads to compressive stress reduction, increased mechanical stability, and adhesion, as well as lower optical band gap (higher solar absorption). [ 36,37 ] In our case, SiC also acts as the diffusion barrier, [ 38 ] and prevents the oxidation or diffusion of tungsten nanoclusters at higher temperatures. The as‐deposited ultrathin SiC‐W absorptive stack on tungsten layer maintained its outstanding optical performance after annealing at 1050 K in vacuum, and 900 K in air.…”
Section: Resultsmentioning
confidence: 99%
“…A fundamental solution to address this issue is to apply a heat treatment process to the thin silicon layers, which will result in the silicon recrystallization (Baskar, 2019;Wilken et al, 2022). However, this solution faces a major problem, which is that the recrystallization of silicon begins at temperatures above 900°C, and complete crystallization of the amorphous film requires higher temperatures and longer heat treatment times.…”
Section: Introductionmentioning
confidence: 99%