Effect of Thermal Cycle Loadings on Mechanical Properties and Thermal Conductivity of a Porous Lead-Free Solder Joint

Aravindhan, Surendar; Akhmetov, Linar G.; Ilyashenko, Lubov K.; Maseleno, Andino; Samavatian, Vahid

doi:10.1109/tcpmt.2018.2861777

Cited by 17 publications

(1 citation statement)

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“…The failure detection of chip solder layer and substrate solder layer can be realized by differential structure functions and integral structure functions [18][19]. With the increase of numbers of temperature cycles, the voids in the solder layer of IGBT modules gradually increase, resulting in the decrease of the effective heat transfer area of the solder layer, and the creep strain of the contact surface between chip and solder is larger than the internal strain of solder layer [20]. In order to investigate the failure mechanism evolution of chip solder layer, the authors make a cross section of the module before the pulse high-current power cycling.…”

Section: Introductionmentioning

confidence: 99%

Prediction of Chip Solder Fatigue in IGBTs

Yao

Tang

2020

IEEJ Transactions Elec Engng

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Non-member Fang Yao a , Non-member Shengxue Tang, Non-member Chip solder degradation is one of the main factors affecting the reliable operation of insulated gate bipolar transistor (IGBT) modules. However, there are still many challenges to get the real lifetime of chip solder. This paper proposes a lifetime consumption prediction method based on chip solder failure. First, the constant high junction temperature fluctuations are applied to IGBT modules for the power cycling tests. The transient thermal resistance is measured to monitor the degradation process of IGBT modules for every 1000 times of aging tests. And the failure degree of chip solder is analyzed by the integral structure function. With the help of scanning acoustic microscope, the failure analysis of aging modules is carried out. The finite element simulation model is established to analyze the transient thermomechanical characteristics of chip solder. Then, the influences of different power cycling conditions on the viscoplastic strain of chip solder are analyzed quantitatively. The average value of the viscoplastic strain increment is obtained by the integral method under large thermal loading. Meanwhile, the method is also applicable to the low thermal loading. Finally, a study case of IGBT modules in a 1.5 MW grid-side wind power converter is given to demonstrate the validity of the proposed method.

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Section: Introductionmentioning

confidence: 99%