Effect of thermal cycling on the mechanical properties of Zr41Ti14Cu12.5Ni10Be22.5 alloy

Mechanical behavior of bulk metallic glass prepared by copper mold casting with reversed pressure

“…Greer et al (2013) proposed that the mechanical behavior of metallic glasses strongly depends on their thermal and mechanical history. Therefore, typical thermal treatments such as sub-T g annealing (Ramamurty et al, 2002), over-T g annealing , thermal cycling (Wang et al, 2012(Wang et al, , 2013 and electropulsing treatment (Zhang and Yao, 2005) all obviously affect the structural relaxation behaviors and mechanical properties of BMGs. For similar reasons, typical casting parameters such as cast temperature (Mao et al, 2009(Mao et al, , 2010 and cooling rate (Shen et al, 2007;Hu et al, 2012) also show great influence on structure and property of BMGs.…”

Microstructure, wetting property of Sn–Ag–Cu–Bi–xCe solder and IMC growth at solder/Cu interface during thermal cycling

“…Excessive IMC growth will deteriorate the joint Relationship between wetting force and Ce content for Sn-3.3Ag-0.2Cu-4.7Bi-xCe solders strength due to its brittle characteristics [18,19]. Hence, the interfacial interaction affects the long-term reliability of solder joint.…”

Flow units: the“defects”of amorphous alloys

“…Peierls 估算出移动位错的力(T=0 K)约 10 3 G [3] , [6][7][8][9][10] . 其形变和 断裂规律和晶体物质完全不同, 但是有很多实验证 据表明非晶在形变和断裂过程中和纳米尺度的局域 流变、其结构的纳米尺度的不均匀性密切相关, 即非 晶固体中可能存在类似晶体中的"缺陷"即流变单元.…”