Effect of Thiourea on Oxidation of Hypophosphite Ions on Ni Surface Investigated by Raman Spectroscopy and DFT Calculation

Jiang, Bin; Kunimoto, Masahiro; Yanagisawa, Masahiro; Homma, Takayuki

doi:10.1149/2.073309jes

Cited by 11 publications

(5 citation statements)

References 36 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…15 DFT calculation.-The ability of DFT to provide a molecular level understanding of several solid-liquid interfacial reaction system behaviors in aqueous solution has been shown in our previous studies. [16][17][18] All calculations were performed by DFT with Gaussian 09. 19 The exchange-correlation function was B3LYP, the basis set for H and Cl was 6-31+G * * , 20,21 and the basis set for Si was LANL 2DZ dp ECP.…”

Section: Eqcm Measurement-amentioning

confidence: 99%

See 1 more Smart Citation

Analysis of Cathodic Reaction Process of SiCl₄during Si Electrodeposition in Ionic Liquids

Tsuyuki

Fujimura

Kunimoto

et al. 2017

J. Electrochem. Soc.

Self Cite

View full text Add to dashboard Cite

Elementary steps in the electrochemical reduction process of SiCl 4 in trimethyl-n-hexylammonium bis(trifluoromethylsulfonyl) imide (TMHATFSI) was investigated, focusing on molecular level behavior of the reactants at solid-liquid interface. Electrochemical measurements using an electrochemical quartz crystal microbalance (EQCM) identified a reduction peak corresponding to Si electrodeposition and several elementary steps with stable intermediates forming prior to the deposition. For detailed analysis, X-ray reflectivity (XRR) measurements with synchrotron radiation were applied in situ. The change in reflectivity of the electrode surface during the deposition was found to be due to the formation of a polymer-like Si such as Si 2 Cl 6 , which is an intermediate layer during the deposition process. These results were theoretically supported by density functional theory (DFT) calculations: after an electron transfers from the electrode, the Si in SiCl 4 forms the bond with another SiCl 4 , rather than the Si of the substrate, resulting in the formation of the intermediate structure. These data suggest an elementary step in the SiCl 4 reduction process which can be described as follows; when SiCl 4 is reduced, a polymer-like Si form such as Si 2 Cl 6 is generated. This intermediate species further reacts with other Si reactants after receiving additional electrons, which then finally deposits as Si on the substrate.

show abstract

Section: Eqcm Measurement-amentioning

confidence: 99%

“…[16][17][18] All calculations were performed by DFT with Gaussian 09. 19 The exchange-correlation function was B3LYP, the basis set for H and Cl was 6-31+G * * , 20,21 and the basis set for Si was LANL 2DZ dp ECP.…”

mentioning

confidence: 99%

Analysis of Cathodic Reaction Process of SiCl₄during Si Electrodeposition in Ionic Liquids

Tsuyuki

Fujimura

Kunimoto

et al. 2017

J. Electrochem. Soc.

Self Cite

View full text Add to dashboard Cite

show abstract

“…Experimental evidence indicates that the H • (ads) species can react to form H 2 via eq , which is released from the surface, or reduce Ni II to Ni I via eq , which disproportionates to deposit additional Ni 0 metal per eq : In closing this section, we note the extensive DFT molecular modeling and experimental work concerning H 2 PO 2 – oxidation spanning more than two decades to date by the Homma group. ,− These researchers have utilized DFT modeling, in conjunction with plasmon-enhanced Raman measurements, to better understand and observe H 2 PO 2 – intermediates present during the oxidation reaction. Their efforts have demonstrated that oxidation requires the formation of 5-coordinate, rather than 3-coordinate, intermediates.…”

Section: Elementsmentioning

confidence: 99%

Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

show abstract

“…We also attempted to develop an approach to combine in situ surface-enhanced Raman spectroscopy with theoretical calculations for analyzing the behavior of reductants and additives in detail, [25][26][27] and these approaches will provide possibilities to achieve further precise control of deposition.…”

Section: Theoretical Analysis On the Reaction Mechanism Ofmentioning

confidence: 99%

Electrochemical Processes for the Fabrication of Functional Micro–nano Structures and Devices: Mechanistic Understanding and Process Development

Homma

2015

Electrochemistry

Self Cite

View full text Add to dashboard Cite

Electrochemical approaches for the fabrication of functional micro-nano structures and devices were comprehensively described primarily on the basis of the results obtained from previous studies conducted by the author's group with the aim of demonstrating the potential for achieving further precise controllability. First, a theoretical study was conducted for investigating the processes, mainly focusing upon electroless deposition to present an approach for analyzing its reaction mechanism from the molecular level. These approaches could be powerful tools for elucidating the overall process and could contribute toward achieving the precise design of processes. Second, some experimental approaches for achieving the precise control of micro-nano fabrication of functional structures, such as maskless and electroless fabrication of metal nano-patterns, lateral enhanced electrodeposition to form ultrathin layers, as well as the nanostructures for various devices by through-mask electrochemical deposition, were introduced to demonstrate high capability of the processes for nanoscale fabrication in various applications.

show abstract

Effect of Thiourea on Oxidation of Hypophosphite Ions on Ni Surface Investigated by Raman Spectroscopy and DFT Calculation

Cited by 11 publications

References 36 publications

Analysis of Cathodic Reaction Process of SiCl₄during Si Electrodeposition in Ionic Liquids

Analysis of Cathodic Reaction Process of SiCl₄during Si Electrodeposition in Ionic Liquids

Electroless Metallization of the Elements: Survey and Progress

Electrochemical Processes for the Fabrication of Functional Micro–nano Structures and Devices: Mechanistic Understanding and Process Development

Contact Info

Product

Resources

About

Effect of Thiourea on Oxidation of Hypophosphite Ions on Ni Surface Investigated by Raman Spectroscopy and DFT Calculation

Cited by 11 publications

References 36 publications

Analysis of Cathodic Reaction Process of SiCl4during Si Electrodeposition in Ionic Liquids

Analysis of Cathodic Reaction Process of SiCl4during Si Electrodeposition in Ionic Liquids

Electroless Metallization of the Elements: Survey and Progress

Electrochemical Processes for the Fabrication of Functional Micro&ndash;nano Structures and Devices: Mechanistic Understanding and Process Development

Contact Info

Product

Resources

About

Analysis of Cathodic Reaction Process of SiCl₄during Si Electrodeposition in Ionic Liquids

Analysis of Cathodic Reaction Process of SiCl₄during Si Electrodeposition in Ionic Liquids

Electrochemical Processes for the Fabrication of Functional Micro–nano Structures and Devices: Mechanistic Understanding and Process Development