Effect of Tin Addition on the Properties of Electroless Ni-P-Sn Ternary Deposits

Zou, Yong; Cheng, Yanhai; Cheng, Lin; Wen, Liu

doi:10.2320/matertrans.mc200917

Cited by 19 publications

(3 citation statements)

References 43 publications

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“…It could be observed from these SEM micrographs that the amount of SnCl 4 in the plating bath significantly affects the nucleation rate and the growth of the coating, thus affecting the surface structure of coatings. These findings are consistent with the study obtained by Zou et al The deposition rate of Ni–Sn–P alloy coatings is usually lower than that of Ni–P coatings due to the synergistic effect of metal ions in the process of electroless deposition. In addition, the strong adsorption of SnO3 2− anion on the surface of coatings inhibits and poisons the autocatalytic reaction, which is also one of the reasons for the low deposited rate …”

Section: Resultssupporting

confidence: 93%

Microstructure and properties of open‐cell Ni–Sn–P alloy foams prepared by electroless plating

Liu

Gan

Zhou

2019

Materials & Corrosion

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In this study, open-cell Ni-Sn-P alloy foams were prepared by electroless plating. The influence of tin content on the surface morphology and properties of Ni-Sn-P alloy foams were investigated. The surface structure of Ni-Sn-P alloy foams became more uniform and compact with the increase of Sn content.The X-ray diffraction result showed that Ni-Sn-P alloy foams gradually transformed from an amorphous structure into crystallization with the increase of heat-treatment temperature. The introduction of Sn significantly enhanced the corrosion resistance of Ni-P coatings in 3.5 wt% NaCl solution, the corrosion current density decreased from 5.022 to 0.805 μA/cm 2 and the corrosion potential shifted positively from −0.423 to −0.294 V after adding 5.96 wt% Sn to Ni-P coatings. However, the corrosion resistance of Ni-Sn-P foams was deteriorated after heat treatment. Adding Sn to the Ni-P system slightly weakened the compressive strength of Ni-P binary foams. Nevertheless, significant improvement in the antioxidant performance of Ni-Sn-P alloy foams was indicated by the reduction of the mass change rate in that the mass change rate of Ni-P foams obviously reduced from 5.15% to 0.25% after adding 5.96 wt% Sn. K E Y W O R D Scorrosion resistance, electroless plating, heat treatment, Ni-Sn-P alloy foams, oxidation resistance

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Section: Resultssupporting

confidence: 93%

Microstructure and properties of open‐cell Ni–Sn–P alloy foams prepared by electroless plating

Liu

Gan

Zhou

2019

Materials & Corrosion

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“…Therefore, it is concluded that the presence of C 3 N 4 in the coating promotes the formation of crystalline phase; see a similar case in Ref. [26].…”

Section: Structures Of the Ni-p And Ni-p-c 3 N 4 Coatingsmentioning

confidence: 75%

Synthesis, Characterization, and Application of Novel Ni-P-Carbon Nitride Nanocomposites

et al. 2018

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Dispersion of 2D carbon nitride (C 3 N 4 ) nanosheets into a nickel phosphorous (NiP) matrix was successfully achieved by ultrasonication during the electroless plating of NiP from an acidic bath. The morphology and thickness, elemental analysis, phases, roughness, and wettability for as-plated and heat-treated nanocomposite were determined by scanning electron microscopy, energy-dispersive X-ray spectroscopy, X-ray diffraction, atomic force microscopy, and contact angle measurements, respectively. C 3 N 4 showed a homogeneous distribution morphology in the nanocomposite that changed from amorphous in case of the NiP to a mixed crystalline-amorphous structure in the NiP-C 3 N 4 nanocomposite. The microhardness and corrosion resistance of the as-plated nanocomposite and the heat-treated nanocomposite coating were significantly enhanced compared to the Ni-P. The nanocomposite showed a superior corrosion protection efficiency of~95%, as observed from the electrochemical impedance spectroscopy (EIS) measurements. On the other hand, the microhardness of the nanocomposite was significantly increased from 780 to reach 1175 HV 200 for NiP and NiP-C 3 N 4 , respectively.

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“…The primary industrial metals that are plated include nickel, copper, gold, palladium, and silver. Ternary alloys are also possible and have shown great potential, but to date they have not been successfully introduced into significant, commercial applications (40,41).…”

Section: Theory Of Electroless Platingmentioning

confidence: 99%

Electroless Deposition

Durkin

2016

Kirk-Othmer Encyclopedia of Chemical Technology

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Over the past 15 years, several legislative regulations have been implemented that have impacted the evolution of electroless technology and the chemistry platforms utilized across many industries. In year 2000, as a result of the implementation of End of Life Vehicle (ELV) 2000/53/EC Annex II and Restriction of Hazardous Substances (RoHS) 2002/95/EC regulatory introductions, specifically the electroless nickel-phosphorus technology (ENP) that had existed since the 1960s, required redevelopment to meet these demands if these coatings were to remain a viable option in the marketplace.Specific for electroless chemistry systems, these regulatory initiatives impacted the utilization of lead stabilizers and cadmium brighteners by restricting their use. Since this time, the surface finishing industry suppliers of these technologies entered a phase of reinvention for their replacement. To date, this technology rework has afforded many of the chemical suppliers and the industry educators, who focused on this chemistry, an opportunity to improve the technology through rejuvenated research and development (R&D) programs and investment for the technology. During this redevelopment period, technology suppliers providing electroless systems have been able to demonstrate many advances in replacing the original 60-year-old technology platforms where lead and cadmium were utilized as primary stabilizers and brightener species for meeting various applications in the automotive, aerospace, electronics, and industrial sectors. As a result of new investment and the success of R&D programs, this author believes the industry has reached a new platform of electroless technology development and the performance of these newer systems has surpassed ENP developed prior to 2009. Over the past several years, the technology has evolved to a fifth generation phase of development and will continue to move forward with release of improved performance systems (1). This evolution of the technology can be summarized in the following EN revolutionary historical perspective: $1955-1960 Kanigen: 7-10% P, difficult to operate, general-purpose EN, no longer a laboratory curiosity.

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Effect of Tin Addition on the Properties of Electroless Ni-P-Sn Ternary Deposits

Cited by 19 publications

References 43 publications

Microstructure and properties of open‐cell Ni–Sn–P alloy foams prepared by electroless plating

Microstructure and properties of open‐cell Ni–Sn–P alloy foams prepared by electroless plating

Synthesis, Characterization, and Application of Novel Ni-P-Carbon Nitride Nanocomposites

Electroless Deposition

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