Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

Chan, Kit‐Lam; Mariatti, M.; Lockman, Zainovia; Sim, L. C.

doi:10.1007/s10854-009-9991-3

Cited by 22 publications

(13 citation statements)

References 13 publications

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“…One of the explanations is that SN particles have lower specific heat capacity, with a value of 710.6 J/kg K, than the BN particles, with a value of 794 J/kg K. Hence, BN particles absorb more energy than the SN particles and catalyzed the degradation faster than SN particles at a lower temperature. Previous work by Chan et al 23 reported that smaller particle size can destabilize the nanocomposites at the initial stage of heating. This is because smaller particle surface contributes to a higher specific surface area, thus creating more sites of thermal degradation upon heating.…”

Section: Resultsmentioning

confidence: 97%

“…Weight loss of unfilled silicone rubber was caused by oxidation and combustion of narrow molecular weight fractions of the siloxane matrix. Thermal decomposition also occurred at higher temperature when slight weight loss happened at 700 C. Furthermore, some inorganic materials like amorphous carbon remained at a temperature higher than 800 C. 23…”

Section: Thermal Stability Of Nanoparticle-filled Silicone Rubber Compositesmentioning

confidence: 99%

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Effects of types of fillers and filler loading on the properties of silicone rubber composites

Kong

Mariatti

Busfield

2011

Journal of Reinforced Plastics and Composites

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In this study, the effects of loading levels of nano BN, nano SN and synthetic ND particles on the thermal and mechanical properties of silicone rubber were investigated. Nanoparticle-filled silicone rubber composites were prepared by cast molding process. In general, incorporation of thermally conductive nanoparticles to the silicone rubber matrix improved the thermal conductivity of the composites. BN particles have the most pronounced effect on the thermal conductivity in comparison to SN and ND particles at any given loading level. TGA studies revealed that the thermal stability of the SN/ silicone rubber system increased as the filler loading level increased; however, BN and ND facilitated the thermal degradation of the silicone rubber nanocomposites. For tensile test, it is observed that the addition of nanoparticles generally increased the tensile strength of silicone rubber composites compared to the neat silicone rubber. However, for BN system, the tensile strength of the composites decreased when more than 1.5 vol.% of BN is loaded in the system. The reduction was caused by the existence of voids and agglomerations in the BN/silicone rubber system. In general, tensile modulus and strain at break of nanocomposites increased with the incorporation of nanoparticles into silicone rubber matrix.

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Section: Resultsmentioning

confidence: 97%

Section: Thermal Stability Of Nanoparticle-filled Silicone Rubber Compositesmentioning

confidence: 99%

Effects of types of fillers and filler loading on the properties of silicone rubber composites

Kong

Mariatti

Busfield

2011

Journal of Reinforced Plastics and Composites

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“…However, in reality, this ideal conductive network is not easy to achieve because of the issue of segregation of the nanosized filler, as shown in Figure 4. Attempts at preventing agglomeration with processing techniques were reported in our previous article 17. Hence, the electrical percolation threshold could only be attained when a higher filler loading (5 vol %) was introduced into the epoxy matrix.…”

Section: Resultsmentioning

confidence: 99%

Effects of the size and filler loading on the properties of copper‐ and silver‐nanoparticle‐filled epoxy composites

Chan

Mariatti

Lockman

et al. 2011

J of Applied Polymer Sci

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Copper-nanoparticle (CuNP)-filled nanocomposites were prepared with various particle sizes and loadings. The nanocomposites incorporating 20-nm CuNPs with 5 vol % loading displayed optimum properties as determined by electrical, mechanical, and thermal characterization. Silver nanoparticles (AgNPs) with a size of 20 nm were loaded into the epoxy resin to allow a comparison of the properties. Interestingly, at the percolation threshold, a 5 vol % loading of CuNP and AgNP nanocomposites resulted in slightly similar electrical conductivities of 0.01 and 0.02 S/cm, respectively. The CuNP and AgNP nanocomposites were also subjected to thermal aging at 150 C, and we observed that the electrical conductivity of both nanocomposites dropped only by about one order of magnitude after 8 weeks of exposure.

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“…It is noticeable that the thermal degradation temperature of the AgNP nanocomposites tends to be lower with increasing AgNP content. Chan et al suggested, as a possible reason of this behavior, that the addition of metal‐based filler does not improve but rather reduces the thermal stability of polymer matrix. The uniform dispersion of metal nanoparticles with high specific surface area in a polymer matrix can destabilize the composite matrix and provide more sites for thermal degradation upon heating.…”

Section: Resultsmentioning

confidence: 99%

A comprehensive feasibility study on the properties of LDPE‐Ag nanocomposites for food packaging applications

Bumbudsanpharoke¹,

Lee²,

Ko³

2017

Polymer Composites

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The intense recent interest in active food packaging with silver nanoparticles (AgNPs) is attributed to the extraordinary efficacies of the AgNPs against a broadspectrum of food-borne pathogens. A comprehensive study of silver nanocomposites was conducted to identify the effect of the AgNPs on the properties of low-density polyethylene (LDPE) for food packaging applications. The investigation included the study of the optical, thermal, mechanical, and barrier properties, as well as antimicrobial activity against Grampositive and Gram-negative bacteria. Upon addition of AgNPs in LDPE, LDPE-AgNP composite films became less transparent and more yellowish because of surface plasmon resonance vibrations of the AgNPs. The SEM, EDS, and TEM results revealed that spherical AgNPs were distributed on both surface and interior of the LDPE film. While these well-dispersed AgNPs enhanced the barrier properties of LDPE for both oxygen and water vapor, the incorporation of AgNPs impinged onto the thermal properties by reducing the thermal stability and the melting enthalpy of the LDPE film. In addition, LDPE-AgNP composite film showed effective antibacterial activity against Staphylococcus aureus and Escherichia coli. These findings suggest that the LDPE-AgNP composite film can be feasibly used in food packaging to preserve the food quality and extend the shelf-life of the product. POLYM. COM-POS., 00:000-000, used in food packaging to preserve the food quality and extend the shelf-life of the product. POLYM. COMPOS., 39:3178-3186, 2018. FIG. 2. FE-SEM images of surface and cross-sections of neat LDPE and LDPE-AgNP composite films: (a) neat LDPE; (b) LDPE-AgNP 3 ppm; (c) LDPE-AgNP 36 ppm; (d) LDPE-AgNP 75 ppm; and (e) LDPE-AgNP 240 ppm. [Color figure can be viewed at wileyonlinelibrary.com]

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Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

Cited by 22 publications

References 13 publications

Effects of types of fillers and filler loading on the properties of silicone rubber composites

Effects of types of fillers and filler loading on the properties of silicone rubber composites

Effects of the size and filler loading on the properties of copper‐ and silver‐nanoparticle‐filled epoxy composites

A comprehensive feasibility study on the properties of LDPE‐Ag nanocomposites for food packaging applications

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