Effect of viscoelasticity of PDMS on transfer printing

Wu, Jing; Dan, Qiang; Liu, Sheng

doi:10.1109/icept.2015.7236694

Cited by 5 publications

(2 citation statements)

References 3 publications

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“…At this time, using PDMS with a low base fluid to the curing agent ratio to stick down the silicon nano-films structure from the silicon substrate. When the curing temperature, time, environment, and other conditions are the same, the lower the proportion of the curing agent added, the stronger the surface adhesion of the cured PDMS to silicon nano-films [ 20 ]. Then, the PDMS with a high base fluid to the curing agent ratio adhered the silicon nano-films from the surface of the PDMS stamp.…”

Section: Resultsmentioning

confidence: 99%

Batch Transfer Printing of Small-Size Silicon Nano-Films with Flat Stamp

et al. 2021

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Silicon nano-film is essential for the rapidly developing fields of nanoscience and flexible electronics, due to its compatibility with the CMOS process. Viscoelastic PDMS material can adhere to Si, SiO2, and other materials via intermolecular force and play a key role in flexible electronic devices. Researchers have studied many methods of transfer printing silicon nano-films based on PDMS stamps with pyramid microstructures. However, only large-scale transfer printing processes of silicon nano-films with line widths above 20 μm have been reported, mainly because the distribution of pyramid microstructures proposes a request on the size of silicon nano-films. In this paper, The PDMS base to the curing agent ratio affects the adhesion to silicon and enables the transfer, without the need for secondary alignment photolithography, and a flat stamp has been used during the transfer printing, with no requirement for the attaching pressure and detaching speed. Transfer printing of 20 μm wide structures has been realized, while the success rate is 99.3%. The progress is promising in the development of miniature flexible sensors, especially flexible hydrophone.

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Section: Resultsmentioning

confidence: 99%

Batch Transfer Printing of Small-Size Silicon Nano-Films with Flat Stamp

et al. 2021

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“…A high registration quality of printed structures is critical for the high-performance LAE as poor registration may lead to poor control over device dimensions and hence greater variation in device-to-device performance 17 . The use of a viscoelastic soft stamp in conventional transfer printing may degrade the registration quality of the printed NSs 43,44 . For instance, periodic wavy/buckled structures formed spontaneously with specific amplitudes defined by the moduli of the materials and the thicknesses of the structures.…”

Section: This Workmentioning

confidence: 99%

Direct roll transfer printed silicon nanoribbon arrays based high-performance flexible electronics

et al. 2021

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Transfer printing of high mobility inorganic nanostructures, using an elastomeric transfer stamp, is a potential route for high-performance printed electronics. Using this method to transfer nanostructures with high yield, uniformity and excellent registration over large area remain a challenge. Herein, we present the ‘direct roll transfer’ as a single-step process, i.e., without using any elastomeric stamp, to print nanoribbons (NRs) on different substrates with excellent registration (retaining spacing, orientation, etc.) and transfer yield (∼95%). The silicon NR based field-effect transistors printed using direct roll transfer consistently show high performance i.e., high on-state current (Ion) >1 mA, high mobility (μeff) >600 cm2/Vs, high on/off ratio (Ion/off) of around 106, and low hysteresis (<0.4 V). The developed versatile and transformative method can also print nanostructures based on other materials such as GaAs and thus could pave the way for direct printing of high-performance electronics on large-area flexible substrates.

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