Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation

Wild, Paul; Lorenz, Dominik; Grözinger, Tobias; Zimmermann, André

doi:10.1016/j.microrel.2018.04.014

Cited by 36 publications

(12 citation statements)

References 6 publications

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“…In this process, the gaps between the solder particles merge and form voids. 22 Some voids will disappear from the molten solder, but other voids will remain and become voids in the solder joint. Secondly, when the chip is pressed on the substrate with solder paste and the solder paste is insufficient, a part of the gap appears in the solder paste, thereby forming a large gap after reflow.…”

Section: Void Detection Of Solder Joints Of Flip Chip Led Chipsmentioning

confidence: 99%

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Zhai

Zou

et al. 2021

Journal of Elec Materi

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This paper investigates the effect of soldering temperature on solder joint voids and reliability of flip-chip LED chips during reflow soldering. Lead-free solder SAC305 was used as solder paste. The void ratio of the flip-chip LED solder joint at 250°C, 260°C, 270°C, 280°C, and 290°C reflow soldering temperatures was detected by x-ray detector. Shear tests were conducted to evaluate the influence of interfacial reactions on the mechanical reliability of solder joints. The distribution of voids in the shear section was observed by scanning electron microscope (SEM). Next, the photoelectric and thermal properties of FC-LED filament were tested and analyzed. Finally, a hightemperature and high-humidity aging experiment was carried out to test the reliability of the LED filament. The results show that the void ratio of the LED filament soldering joint is the lowest when the soldering temperature is 270°C. The small void ratio of the solder joints results in lower steady-state voltage and junction temperature of the flip-chip LED filament. As the void density in the solder joint decreases, the shear strength of the solder joint increases. At this time, the shear resistance and mechanical reliability are the highest.

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Section: Void Detection Of Solder Joints Of Flip Chip Led Chipsmentioning

confidence: 99%

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Zhai

Zou

et al. 2021

Journal of Elec Materi

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“…It can be seen that the escape velocity of the bubbles will increase with the increase of the pressure. The relationship between the pressure and the movement velocity of the bubbles in the voids is shown in Figure 4 below [4,5].…”

Section: Fig 3 Relationship Between Radius and Velocitymentioning

confidence: 99%

Analysis of Void Formation Mechanism in the Vacuum Reflow Soldering Process of Semiconductor Laser Diode

Xu¹,

Wang²,

Wang³

et al. 2021

Preprint

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In this paper, the vacuum reflow soldering technology for semiconductor laser chips in optoelectronic devices was studied and analyzed in a systematic manner. Through the study on the key elements in the reflow soldering process, such as the selection of solders, <a>chamber</a> vacuum, flux, and the pressure applied by the fixture on the chip, this paper focused on exploring the formation mechanism of voids in the solder layer when the device was resoldered. Also, the change in the movement of gas bubbles in the voids with changing reflow oven chamber conditions and its underlying law were analyzed, by preparing 200 C-package semiconductor laser diodes and verifying the reliability and stability of the theoretical analysis through inspection and test aging. which could provide a theoretical basis for the use of the vacuum reflow soldering technology to reduce the void rate in the soldering process of devices.

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“…Since the solder has reached half of the melting point temperature at room temperature and has viscoplastic behavior at high temperature, Anand constitutive model is adopted to describe the mechanical behavior of lead‐free solder. Nine parameters need to be input into the finite element analysis software, namely Q / R , A , ξ , m , h 0 ,

\overset{true^}{S}

, n , a and the initial value of deformation impedance S 0 , these parameters were shown in Table III [26].…”

Section: Failure Mechanism Of Chip Soldersmentioning

confidence: 99%

Prediction of Chip Solder Fatigue in IGBTs

Yao

Tang

2020

IEEJ Transactions Elec Engng

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Non-member Fang Yao a , Non-member Shengxue Tang, Non-member Chip solder degradation is one of the main factors affecting the reliable operation of insulated gate bipolar transistor (IGBT) modules. However, there are still many challenges to get the real lifetime of chip solder. This paper proposes a lifetime consumption prediction method based on chip solder failure. First, the constant high junction temperature fluctuations are applied to IGBT modules for the power cycling tests. The transient thermal resistance is measured to monitor the degradation process of IGBT modules for every 1000 times of aging tests. And the failure degree of chip solder is analyzed by the integral structure function. With the help of scanning acoustic microscope, the failure analysis of aging modules is carried out. The finite element simulation model is established to analyze the transient thermomechanical characteristics of chip solder. Then, the influences of different power cycling conditions on the viscoplastic strain of chip solder are analyzed quantitatively. The average value of the viscoplastic strain increment is obtained by the integral method under large thermal loading. Meanwhile, the method is also applicable to the low thermal loading. Finally, a study case of IGBT modules in a 1.5 MW grid-side wind power converter is given to demonstrate the validity of the proposed method.

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Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation

Cited by 36 publications

References 6 publications

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Analysis of Void Formation Mechanism in the Vacuum Reflow Soldering Process of Semiconductor Laser Diode

Prediction of Chip Solder Fatigue in IGBTs

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