Effect of Zn addition on Cu<sub>3</sub>Sn formation in Sn-10Cu alloys

Mehreen, Syeda U.; Nogita, Kazuhiro; McDonald, Stuart D.; StJohn, David H.

doi:10.1088/1757-899x/701/1/012009

Cited by 3 publications

(1 citation statement)

References 8 publications

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“…Moreover, Jun Shen reported that Cu addition decreased melting point and refined microstructure, which resulted in an increase in both ultimate tensile strength and ductility of Sn-Bi-based alloy [31]. Development of Pb-free alloys using high Cu content (4-20 wt.%) has been carried out by several researchers [32][33][34][35][36]. Among them, Li Yang et al [36] studied microstructure evolution and shear strength of solder joint using In-Sn-20Cu composite particles by transient liquid phase (TLP) bonding.…”

Section: Introductionmentioning

confidence: 99%

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Han

Shen

Huo

et al. 2021

Metals

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The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint.

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Section: Introductionmentioning

confidence: 99%

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Han

Shen

Huo

et al. 2021

Metals

View full text Add to dashboard Cite

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Effect of Ni, Zn, Au, Sb and In on the Suppression of the Cu3Sn Phase in Sn-10 wt.%Cu Alloys

Mehreen

Nogita

McDonald

et al. 2021

J. Electron. Mater.

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Since manufacturing is transitioning into Pb-free solder development for electronic assembly and packaging, consumer demands for more compact electronics have increased the importance of reliability issues brought about by the increased density of circuitry. Therefore, the role of alloying elements that can be added to common Pb-free solders such as Sn-Cu or SnAg -Cu alloys in enhancing the properties and performance of the solder becomes important. Microstructural analysis along with direct observation in situ synchrotron radiography were used to study the effect of Ni, Zn, Au, In and Sb on the development of phases in Sn-10 wt.%Cu (Sn-10Cu). It was found that adding Ni and Zn to a Sn-10Cu alloy had the greatest impact on the microstructure with the Cu 3 Sn phase completely absent after these additions were made. Additions of Au and In also resulted in a reduction in the amount of Cu 3 Sn; however, the effect was not as pronounced. Removing the Cu 3 Sn phase from Sn-Cu Pb-free solder alloys is a possible approach for the design of more desirable microstructures that translate to better performance in modern electronic packaging.

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