Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime

Mehreen, Syeda U.; Nogita, Kazuhiro; McDonald, Stuart D.; Yasuda, Hideyuki; StJohn, David H.

doi:10.1016/j.actamat.2021.117295

Cited by 15 publications

(1 citation statement)

References 38 publications

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“…That was because the high temperature promoted atomic diffusion, and the growth of IMC was then dominated by atomic diffusion [25][26][27][28][29]. Cu 6 Sn 5 grains ripen with the prolongation of aging time, large grains swallowed up small grains, grains became coarse, the number of grains decreased, and the IMC gradually became layered type [30][31][32][33][34].…”

Section: Resultsmentioning

confidence: 99%

Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices

Wang

et al. 2023

Coatings

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New diamond chip resistors have been used in high-power devices widely due to excellent heat dissipation and high-frequency performance. However, systematic research about their solder joint reliability is rare. In this paper, a related study was conducted by combining methods between numerical analysis and laboratory reliability tests. In detail, the shape simulation and thermal cycling finite element simulation for solder joints with different volumes were carried out. The optimized solder volume was 0.05 mm3, and the maximum thermal cycling stress under the optimized shape was 38.9 MPa. In addition, the thermal cycling tests with current and high temperature storage tests were carried out for the optimized solder joint, which showed good agreement with the simulation results, clarified the growth and evolution law of intermetallic compound at the interconnection interface, and proved the optimized solder joint had great anti-electromigration, temperature cycling and high temperature storage reliability. In this work, an optimized solder joint structure of a diamond chip resistor with high reliability was finally obtained, as well as providing considerable reliability data for the new type of diamond chip resistors, which would boost the development of power devices.

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Section: Resultsmentioning

confidence: 99%

Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices

Wang

et al. 2023

Coatings

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Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions

Wang

Zhao

et al. 2023

J Mater Sci: Mater Electron

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Investigation on the Solidification and Phase Transformation in Pb-Free Solders Using In Situ Synchrotron Radiography and Diffraction: A Review

Zeng

Liu

et al. 2021

Acta Metall. Sin. (Engl. Lett.)

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Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime

Cited by 15 publications

References 38 publications

Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices

Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices

Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions

Investigation on the Solidification and Phase Transformation in Pb-Free Solders Using In Situ Synchrotron Radiography and Diffraction: A Review

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