Investigation on the Solidification and Phase Transformation in Pb-Free Solders Using In Situ Synchrotron Radiography and Diffraction: A Review

The present works assesses the knowledge concerning the crystal structures of phases in the Cu–Sn system having their high relevance due to their occurrence in bronze alloys and soldered systems. The crystal structures of the terminal solid solution phases α-Cu and β-Sn and of the stable main intermediate phases β, γ, ε-Cu3Sn, δ-Cu41Sn11, ζ-Cu10Sn3, η-Cu6Sn5 and η′-Cu6Sn5 and some metastable phases appear to be well established in the literature, but details can be intriguing. This paper attempts to review apparently or truly contradictory structure models derived from experimental diffraction data for the different phases, revealing limiting knowledge in some cases. These results are also analyzed regarding the results of first-principles calculations making use of various model structures. The review is also used to highlight exemplarily problems, which can be experienced upon widespread, “routine” means of phase identification, in particular x-ray diffraction (on polycrystalline specimens) and electron backscatter diffraction.

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Orientation optimization of interfacial IMC on (001)-oriented ultra-large-grain copper plating for advanced electronic packaging

Chen,

Luo,

Mao

et al. 2024

Vacuum

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Investigation on the Solidification and Phase Transformation in Pb-Free Solders Using In Situ Synchrotron Radiography and Diffraction: A Review

Cited by 3 publications

References 155 publications

Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates

Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates

The Cu–Sn System: A Comprehensive Review of the Crystal Structures of its Stable and Metastable Phases

Orientation optimization of interfacial IMC on (001)-oriented ultra-large-grain copper plating for advanced electronic packaging

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