Effect of β-Si3N4 seed particles on the property of sintered reaction-bonded silicon nitride

Lee, Joo-Sin; Mun, Jihun; Han, Byung-Dong; Kim, Hai-Doo

doi:10.1016/s0272-8842(03)00034-8

Cited by 21 publications

(10 citation statements)

References 13 publications

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“…The desire for costeffective dense Si 3 N 4 components has led to the research and development of sintered reaction-bonded silicon nitride (SRBSN). [3][4][5][6][7][8][9][10][11][12][13] Compared with the direct sintering of Si 3 N 4 -powder compacts (SSN), SRBSN offers more possibility of reducing production costs of Si 3 N 4 components because of the combina-tion of the cheaper Si raw powder, the 60% weight gains from silicon nitridation, machinability of reaction-bonded silicon nitride (RBSN) body, and lower sintering shrinkage. SRBSN is typically produced by a two-step process: nitridation and postsintering.…”

Section: Introductionmentioning

confidence: 99%

“…It is for this reason that much work has been carried out to investigate and improve the mechanical properties of SRBSN. [7][8][9][10][11][12][13] Many studies showed that the raw Si powder characteristics strongly affect the processing and mechanical properties of SRBSN. Kleebe et al 5,6 showed that the use of fine Si powder with a broad particle size distribution could produce fully dense SRBSN materials with a fine microstructure and high flexural strength, but the higher metallic impurity (Fe and Al) contents inhibited the post-densification of RBSN.…”

Section: Introductionmentioning

confidence: 99%

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Processing and Thermal Conductivity of Sintered Reaction‐Bonded Silicon Nitride. I: Effect of Si Powder Characteristics

Zhu

Zhou

Hirao

et al. 2006

Journal of the American Ceramic Society

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This paper will present sintered reaction‐bonded silicon nitride (SRBSN) material with a high thermal conductivity of 121 W·(m·K)−1, which has been successfully prepared from a coarse Si powder with lower levels of oxygen and aluminum impurities, using a mixture of Y2O3 and MgSiN2 as sintering additives, by nitriding at 1400°C for 8 h and subsequent post‐sintering at 1900°C for 12 h at a nitrogen pressure of 1 MPa N2. This thermal conductivity value is higher than that of the materials prepared from high‐purity α‐Si3N4 powder (UBE SN‐E10) with the same additive composition under the same sintering conditions. In order to study the effects of Si powder characteristics on the processing, microstructure, and thermal conductivity of SRBSN, the other type of fine powder with higher native oxygen and metallic impurity (typically Al and Fe) contents was also used. The effects of Si particle size, native oxygen, and metallic impurities on the nitriding process, post‐sintering process, and thermal conductivity of the resultant SRBSN materials were discussed in detail. This work demonstrates that the improvement in thermal conductivity of SRBSN could be achieved by using higher purity coarse Si powder with lower levels of oxygen and aluminum impurities. In addition, this work also shows that the nitriding temperature has no significant effect on the microstructure and thermal conductivity of SRBSN during post‐sintering, although it does affect the characteristics of RBSN formed during nitridation.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Processing and Thermal Conductivity of Sintered Reaction‐Bonded Silicon Nitride. I: Effect of Si Powder Characteristics

Zhu

Zhou

Hirao

et al. 2006

Journal of the American Ceramic Society

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“…4 Owing to the high degree of covalent bonding, in most cases, densification of Si 3 N 4 requires sintering additives and ther improvement in mechanical properties of SRBSN is feasible by optimising Si particle size and using ␤-Si 3 N 4 seeds. 7 Very recently, some attention has been paid to the thermal conductivity of SRBSN. The previous work reported that the Yb 2 O 3 -MgO and Y 2 O 3 -MgO compositions have an effect on the processing and thermal conductivity of SRBSN.…”

Section: Introductionmentioning

confidence: 99%

Effects of processing method and additive composition on microstructure and thermal conductivity of Si3N4 ceramics

Zhu

Zhou

Hirao

2006

Journal of the European Ceramic Society

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“…The most commonly used additives are magnesium oxide (MgO) and yttrium oxide (Y 2 O 3 ), which can be used separately, in combination or with aluminum oxide (Al 2 O 3 ). Interest in RBSN as a hightemperature engineering ceramics was first shown about twenty years ago by Norman Parr of the admiralty Materials laboratory and Popper [4,5] of the British Ceramic Research Association, in United Kingdom. RBSN produced by reaction bonding of silicon powder compacts is cheaper compared to sintered Si 3 N 4 , because the price of Si powder is much lower than that of Si 3 N 4 powder.…”

Section: Introductionmentioning

confidence: 99%

Structural and Electrical Properties of Reaction Bonded Silicon Nitride Ceramics

Hosneara¹,

Hasnat²,

Bhuyan³

2012

The Open Ceramic Science Journal

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Abstract:The effects of structural properties on the d.c. and a.c. electrical properties of different weight gain reaction bonded silicon nitride (RBSN) have been studied in this work. The degree of nitridation is assessed by the 'weight gain' of the ceramic, the percentage by which the weight is increased in the nitriding reaction. From X-ray diffraction (XRD) patterns, it is observed that a higher degree of nitriadation sample has strong -silicon nitride peaks. Intensity of -silicon nitride peaks decreases with decreasing weight gain. The higher degrees of nitridation, the samples have less significant Si peak. XRD patterns were recorded to calculate the lattice parameters of RBSN. The lattice parameters for three weight gain RBSN samples are found to be a =b = 7.7727 Å, c= 5.6565 Å (26% weight gain), a=b= 7.6272 Å, c= 5.6374 Å (42% weight gain) and a=b=7.6158 Å, c= 5.7732 Å (58.27% weight gain) and are in good agreement with the reported values from XRD patterns. Porosity (%) and surface morphology was observed by SEM.

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Effect of β-Si3N4 seed particles on the property of sintered reaction-bonded silicon nitride

Cited by 21 publications

References 13 publications

Processing and Thermal Conductivity of Sintered Reaction‐Bonded Silicon Nitride. I: Effect of Si Powder Characteristics

Processing and Thermal Conductivity of Sintered Reaction‐Bonded Silicon Nitride. I: Effect of Si Powder Characteristics

Effects of processing method and additive composition on microstructure and thermal conductivity of Si3N4 ceramics

Structural and Electrical Properties of Reaction Bonded Silicon Nitride Ceramics

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