2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference 2007
DOI: 10.1109/asmc.2007.375078
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Effective Process Equipment Defect Control Methodology

Abstract: The aggressive shrinking of design rules with the increasing requirement to reduce costs of running a 300 mm Fab are pushing equipment particle performance to lower defectivity counts and tighter control. The rapid qualification of process equipment and the identification of excursions on monitor wafers before the product is committed is an important metric of a Fab strategy to minimize the product at risk and control cost (faster time to detect/fix excursion). This paper will focus on examining different tech… Show more

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