2023
DOI: 10.2139/ssrn.4343359
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Effective Strain Relaxation of Gesn Single Crystal with Sn Content of 16.5% on Ge Grown by High-Temperature Sputtering

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“…Material Fabrication and Characterization: The GeSn epilayer was grown on (001) oriented n-Ge substrate with an As doping concentration of ≈1 × 10 17 cm −3 using magnetron sputtering epitaxy technique. [40,41] Before growing GeSn, the Ge substrate was successively cleaned by acetone, ethyl alcohol, and de-ionized water in an ultrasonic bath, then was immersed into diluted hydrochloric acid solution, hydrofluoric acid solution, and de-ionized water in turn to remove the surface oxide, followed by spin-drying treatment. After that, the cleaned n-Ge substrate was fixed on the stainless-steel holder and loaded into the sputtering chamber with a base pressure of 5.0 × 10 −5 Pa.…”
Section: Methodsmentioning
confidence: 99%
“…Material Fabrication and Characterization: The GeSn epilayer was grown on (001) oriented n-Ge substrate with an As doping concentration of ≈1 × 10 17 cm −3 using magnetron sputtering epitaxy technique. [40,41] Before growing GeSn, the Ge substrate was successively cleaned by acetone, ethyl alcohol, and de-ionized water in an ultrasonic bath, then was immersed into diluted hydrochloric acid solution, hydrofluoric acid solution, and de-ionized water in turn to remove the surface oxide, followed by spin-drying treatment. After that, the cleaned n-Ge substrate was fixed on the stainless-steel holder and loaded into the sputtering chamber with a base pressure of 5.0 × 10 −5 Pa.…”
Section: Methodsmentioning
confidence: 99%