Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints

Hütter, Matthias; Schmidt, Ralf; Zerrer, Patrick; Rauschenbach, Steffen; Wittke, Klaus; Scheel, Wolfgang; Reichl, H.

doi:10.1109/ectc.2009.5073996

Cited by 10 publications

(7 citation statements)

References 12 publications

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“…A linear relationship between the logarithmic tensile strength and the logarithmic V/A is found. As noticed for the data from Hutter et al and Kim et al's studies [24,26] which are not well-appropriated by linear fitting, this may be due to the significantly slower loading rate, which leads to creep failure [26], and also the excessive IMC growth in solder joints with small V/A ratios, which leads to failure mechanism transition [24].…”

Section: Tensile Behavior Of Solder Jointmentioning

confidence: 91%

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

2019

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With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps. Both the microstructure and mechanical properties of the solder joints are also evolving with the decreasing size, which brings great concern for the reliability of different sizes of solder interconnections. In this paper, the effect of solder size on the microstructure (i.e., interfacial intermetallic compound (IMC) growth, precipitation in the solder matrix, dendrite arms, and undercooling) and mechanical properties (i.e., tensile property, shear and compression strength, fracture toughness, and creep deformation) are reviewed from the mechanical point of view. In addition, some areas for further researches about size effects on solder joints are discussed.

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Section: Tensile Behavior Of Solder Jointmentioning

confidence: 91%

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

2019

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“…However, to the best of our knowledge, the effect of Fe on the microstructure and mechanical properties of the low Ag-content SAC105 solder has not yet been investigated. The effect of Fe is expected to be significant since it has little solubility in a b-Sn matrix and vice versa below 2008C (Massalski, 1986;Kim et al, 2003;Hutter et al, 2009;Gao et al, 2010). Moreover, the FeSn 2 phase may precipitate in the solder (Anderson et al, 2002;Anderson and Harringa, 2004;Hutter et al, 2009).…”

Section: Introductionmentioning

confidence: 99%

“…The effect of Fe is expected to be significant since it has little solubility in a b-Sn matrix and vice versa below 2008C (Massalski, 1986;Kim et al, 2003;Hutter et al, 2009;Gao et al, 2010). Moreover, the FeSn 2 phase may precipitate in the solder (Anderson et al, 2002;Anderson and Harringa, 2004;Hutter et al, 2009). It is well known that the growth and coarsening of the FeSn 2 IMC particles are very small (Choi et al, 2000;Anderson et al, 2002;Hutter et al, 2009;Zerrer et al, 2010).…”

Section: Introductionmentioning

confidence: 99%

“…Moreover, the FeSn 2 phase may precipitate in the solder (Anderson et al, 2002;Anderson and Harringa, 2004;Hutter et al, 2009). It is well known that the growth and coarsening of the FeSn 2 IMC particles are very small (Choi et al, 2000;Anderson et al, 2002;Hutter et al, 2009;Zerrer et al, 2010). Therefore, this work investigated the effects of small additions (0.1 and 0.3 wt.%) of Fe on bulk alloy microstructure and tensile properties, as well as the thermal behaviour of the Sn-1Ag-0.5Cu (SAC105) solder alloy.…”

Section: Introductionmentioning

confidence: 99%

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Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag‐content Sn‐1Ag‐0.5Cu solder alloy

Shnawah

Said²,

Sabri³

et al. 2012

Soldering &Amp; Surface Mount Technology

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Purpose -The purpose of this paper is to investigate the effects of small additions (0.1 and 0.3 wt%) of Fe on the bulk alloy microstructure and tensile properties of low Ag-content Sn-1Ag-0.5Cu lead-free solder alloy. Design/methodology/approach -Sn-1Ag-0.5Cu, Sn-3Ag-0.5Cu and Sn-1Ag-0.5Cu containing 1 and 3 wt.% Fe solder specimens were prepared by melting pure ingots of Sn, Ag, Cu and Fe in an induction furnace and subsequently remelting and casting to form flat dog-bone shaped specimens for tensile testing. The solder specimens were subjected to tensile testing using an INSTRON tester with a loading rate 10-3 s-1. To obtain the microstructure, the solder samples were prepared by dicing, molding, grinding and polishing processes. The microstructural analysis was carried out using scanning electron microscopy/Energy Dispersive X-ray spectroscopy. Electron backscatter diffraction (EBSD) analysis was used to identify the IMC phases. Findings -In addition to large primary b-Sn grains, the addition of Fe to the SAC105 alloy formed large circular shaped FeSn2 IMC particles located in the eutectic regions. This had a significant effect in reducing the elastic modulus and yield strength and maintaining the elongation at the SAC105 level. Moreover, the additions of Fe resulted in the inclusion of Fe in the Ag3Sn and Cu6Sn5 IMC particles. The additions of Fe did not have any significant effect on the melting behaviour.Research limitations/implications -The paper provides a starting-point for studying the effect of minor additions of Fe on the drop impact and thermal cycling reliability of SAC105 alloy considering the bulk alloy microstructure and tensile properties. Further investigations should be undertaken in the future. Originality/value -The effect of Fe addition on the bulk alloy microstructure and tensile properties of the SAC105 alloy has been studied for the first time. Fe-containing SAC105 alloy may have the potential to increase the drop impact and thermal cycling reliability compared with the standard SAC105 alloy.

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“…Today soldering becomes more and more important for high power LEDs [5]. The heat dissipation is up to 30 times better, due to the heat conductivity of the solder itself (e.g.…”

Section: Solderingmentioning

confidence: 99%

Advanced packaging methods for high-power LED modules

et al. 2015

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LED luminaires are already beyond retrofit systems, which are limited in heat dissipation due to the old fitting standards. Actual LED luminaries are based on new LED packages and modules. Heat dissipation through the first and second level interconnect is a key issue for a successful LED package. Therefore the impact of known bonding technologies as gluing and soldering and new technologies like sintering and transient liquid phase soldering were analyzed and compared. A realized hermetic high power LED package will be shown as example. The used new techniques result in a module extremely stable against further assembly processes and harsh operating conditions.

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Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints

Cited by 10 publications

References 12 publications

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag‐content Sn‐1Ag‐0.5Cu solder alloy

Advanced packaging methods for high-power LED modules

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