Gallium oxide (Ga2O3), an emerging ultrabroadband
semiconductor, is a crucial material for developing next-generation
high-efficiency, high-power electronic devices. In this work, we prepared
2D GaO
x
films for lap thin-film transistors
(TFTs) using tumbling to peel off the oxide layer on the surface of
the liquid gallium metal. By treating the 2D GaO
x
films with different annealing temperatures and changing their
internal defect concentrations, we realized the tuning of the films
in terms of optical properties, electrical properties, and the performance
of GaO
x
-based TFT devices with channel
layer thicknesses of less than 10 nm. After annealing, the films were
transformed from amorphous GaO
x
to β-Ga2O3, the visible transmittance was kept above 98%,
the oxygen vacancy concentration decreased from 69 to 9.1%, the figure
of merit increased monotonically from 3.9 to 4.2 eV, and the electrical
characteristics gradually transitioned from a conductor to a semi-insulator.
The I
off of GaO
x
-based TFTs is below 1 nA, and the I
on/I
off can reach 104, showing
excellent potential in electrical devices.