Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate

Chantaramanee, Suchart; Sriwittayakul, Worawit; Sungkhaphaitoon, Phairote

doi:10.4028/www.scientific.net/msf.928.188

Cited by 5 publications

(4 citation statements)

References 17 publications

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“…Based on the existing literature, the primary focus of this investigation is to create a new, pb-free solder alloy (SAC105) infused with indium as a doping agent. Suchart Chantarmanee conducted a study on the mechanical characteristics of the (SAC305) pb-free solder [8]. Similarly, Sungkhaphaitoon et al [9] investigated the impact of adding indium to SAC305 by the resulting hardness of the new alloy.…”

Section: Introductionmentioning

confidence: 99%

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

Hameed,

Wakeel,

Pasha

et al. 2023

Icame 2023

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Section: Introductionmentioning

confidence: 99%

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

Hameed,

Wakeel,

Pasha

et al. 2023

Icame 2023

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“…Among the alloy systems reported by the research team, the more promising is tin-based solder alloys [ 6 , 7 , 8 , 9 ]. In recent years, the research on Sn-Ag-Cu (SAC) solder alloys with high silver content has increased exponentially, because they usually have good mechanical behavior and good welding ability, making them a promising material for microelectronic applications [ 10 , 11 , 12 , 13 , 14 ]. However, SAC solder alloy also has the defects of low melting point and short creep rupture life, which cannot replace high-temperature tin-lead solder [ 15 ].…”

Section: Introductionmentioning

confidence: 99%

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Yan

Gao

et al. 2020

Materials

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To obtain Sn-3.0Ag-0.5Cu-xSb (x = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of IMC and refine the IMC layer. The addition of Sb significantly increased the melting temperature of the solder alloy. Among them, the thermal performance of Sn-3.0Ag-0.5Cu-25Sb is the best. The melting temperature of Sn-3.0Ag-0.5Cu-25Sb is 332.91 °C and the solid–liquid line range of Sn-3.0Ag-0.5Cu-25Sb solder alloy is 313.28–342.02 °C. Its pasty range is 28.74 °C, lower than 30 °C, which is beneficial for soldering. The test results of the mechanical behavior of Sn-3.0Ag-0.5Cu-xSb solder alloy show that with the increase of Sb addition, the ultimate tensile strength of the solder alloy also increases. However, the change of the elongation of the solder alloy is the opposite. The ultimate tensile strength of the solder alloy increased from 29.45 MPa of Sn-3.0Ag-0.5Cu solder to 70.81 MPa of Sn-3.0Ag-0.5Cu-31Sb solder. The reason for the increase in the strength of the solder alloy is the reduction of the thickness of IMC and the solid solution hardening effect of Sb.

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“…It is worth noting that some studies have shown that a low paste temperature can increase the fluidity of the solder in the molten state, which helps it to spread. 20,21 These test results show that addition of an appropriate amount of In can reduce the pasty range of the solder and improve its welding performance.…”

Section: Dsc Analysis Of Solder Alloysmentioning

confidence: 89%

Effect of In on Corrosion Performance of Zn-15Al-5Cu-xIn Solders

Yan

Ren

2021

Journal of Elec Materi

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The salt spray test has been used to study the effect of adding In on the corrosion performance of Zn-15Al-5Cu-xIn (x = 0, 1, 3, and 5, where x is the mass percentage) solder alloys. The focus was on the microstructure and corrosion properties of the alloy. The results of scanning electron microscopy (SEM), energy-dispersive spectrometry (EDS), x-ray diffraction (XRD) analysis, and differential scanning calorimetry (DSC) revealed the distributed formation of In-based solid solution. Corrosion performance tests on the Zn-15Al-5Cu-xIn solders revealed the influence of In on the corrosion performance; addition of 3% In resulted in the solder with the highest corrosion potential and slowest corrosion rate. The main reason is that more c (CuZn 4) phase with strong corrosion resistance was dispersed and distributed in the solder. Remarkably, when the In content exceeded 3%, it could enrich the dendritic zone of the grains, which could reduce the corrosion resistance of the solder alloy. It is thus concluded that the optimal In content in this alloy system is 3%.

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Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate

Cited by 5 publications

References 17 publications

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Effect of In on Corrosion Performance of Zn-15Al-5Cu-xIn Solders

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