Effects of Cf/C density on microstructure and properties of 3-D Cf/ZrC composites prepared by liquid metal infiltration

Zhu, Yujuan; Lei, Jinhong; Yang, Lijun; Wang, Jun; Cheng, L.; Wang, Song

doi:10.1016/j.compositesb.2015.08.004

Cited by 11 publications

(1 citation statement)

References 28 publications

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“…The silicon was added to the reaction chamber and reacted for 400 h at 950 °C to prepare SiC layer [7,8]. During this process, a layer of SiC matrix forms around the carbon fiber by the reaction of pyrocarbon (PyC) and liquid Si, which can protect the carbon fibers from damages of excessive Si and fill the pores in the C/C porous body [9,10].…”

Section: Smentioning

confidence: 99%

Influence of the fiber orientation on 3D C/C–SiC composite material and its formation mechanism of the machining surface

Long

Shi

et al. 2021

Int J Adv Manuf Technol

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Carbon/Carbon (C/C)-SiC composite materials attained much attention due to its unique properties like immense thermal conductivity, high corrosion, and abrasive resistance. Few scholars have systematically studied the grinding machinability of 3D C/C-SiC composite material. In this paper, the grinding experiment of 3D C/C-SiC composite material was carried out with a resin-bonded diamond grinding wheel. The effect of machining conditions on the grinding force, micromorphology, surface quality, and residual stress was studied, and the material removal mechanism was analyzed in-depth aimed at the three typical fiber orientations. The result shows that the surface roughness of different fiber areas follows the order: 90° fiber > 0° fiber > Normal fiber. The fiber's orientation showed a significant effect on the mechanism of material removal. The residual thermal stress of C/C-SiC composite material increases from 32.25 to 207.43 MPa during the grinding process. Polishing the ground surface not only can remove the crack layer and residual stress layer but also can introduce residual compressive stress layer, which can effectively enhance the material strength. The 3D

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