Effects of chloride in acid tin methanesulphonate electrolytes on the deposit thickness, morphologies and compositions

Martyak, Nichölas M.; Seefeldt, Robert

doi:10.1179/002029605x17684

Cited by 2 publications

(1 citation statement)

References 2 publications

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“…Various organic additives such as surface active agents like cetyl tetraalkyl ammonium bromide, aromatic carbonyl compounds, and amine-aldehyde reaction products, methane sulphonic acid and its derivatives, etc. [10][11][12] are used in plating solutions. Excess organic additives, higher current density and high metal ion concentration in the plating solution may have a bearing on solderability.…”

Section: Introductionmentioning

confidence: 99%

Effect of additives on electrodeposition of tin and its structural and corrosion behaviour

2009

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The present investigation deals with the electrodeposition of tin from chloride electrolytes. Gelatin, b-naphthol, polyethylene glycol, peptone and histidine were used as additives in the plating bath to improve the surface morphology, grain size, smoothness and corrosion resistance of the tin deposits. XRD data obtained for electrodeposited tin show polycrystalline nature with single b-phase and tetragonal structure. A uniform and pore free surface was observed under SEM analysis. AFM results indicate the grain refining brought about by the additives. Corrosion rate measurements using the Tafel extrapolation method and electrochemical impedance spectroscopy reveal the increased corrosion resistance from baths containing additives.

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Section: Introductionmentioning

confidence: 99%

Effect of additives on electrodeposition of tin and its structural and corrosion behaviour

2009

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A review of developments in the electrodeposition of tin

Walsh

Low

2016

Surface and Coatings Technology

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Highlights Types of aqueous electrolytes for pure tin deposits are reviewed. The many existing and developing applications of tin deposits are summarised. Emphasis is placed on versatile methanesulfonic acid electrolytes. The effects of bath composition (including additives) and operating conditions on deposit morphology are illustrated. Electrochemical studies at static and controlled flow rotating electrodes are illustrated. AbstractThe importance of tin and its electrodeposition are summarised and the scope for plating tin is outlined.Established applications of electroplated tin include corrosion protection, electronics fabrication and cooking utensils. The past 20 years have seen developments in the science and technology of tin plating, including research into nanostructured deposits, adoption of environmentally friendly methanesulfonic acid baths and more ambitious coatings including multi-layers and composites. Our ability to tailor deposit structure and composition has been improved by newer electrolytes, pulse plating and electrolyte additives. The diversity of tin applications has extended to lithium batteries using newer structures (such as composites, multi-layers and nanostructures), electrical control (e.g., pulsed current) and relative bath/electrode movement (including the use of rotating electrodes). Electrochemical aspects of modern tin deposition are illustrated by data from the authors' laboratory which highlights the versatility of methanesulfonic acid electrolytes. A wide range of deposit morphology, colour and surface finish are possible by the use of suitable addition agents and control of electrode/electrolyte movement and operating conditions. Subject areas needing further research work are identified.

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Effects of chloride in acid tin methanesulphonate electrolytes on the deposit thickness, morphologies and compositions

Cited by 2 publications

References 2 publications

Effect of additives on electrodeposition of tin and its structural and corrosion behaviour

Effect of additives on electrodeposition of tin and its structural and corrosion behaviour

A review of developments in the electrodeposition of tin

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