Effects of Co addition on shear strength and interfacial microstructure of Sn–Zn–(Co)/Ni joints

Li, J. Y.; Peng, Jiangtao; Wang, R. C.; Feng, Yan; Peng, Chaoqun

doi:10.1007/s10854-018-0120-z

Cited by 5 publications

(5 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The new reaction products (mainly Ni 2 Sn 2 Zn) occurred when soldering time was prolonged; thus, the original reaction product is no longer in local equilibrium after reacting at a sufficiently long time [24,37]. The formation of Ni 2 Sn 2 Zn phase between Ni and Ni 5 Zn 21 was also reported in Sn-Zn/Ni joint after prolonged soldering time [15]. In the present work, the Zn in solder is depleted in a later reaction stage, while the products formed in the early stage react with liquid solder (mainly Sn) and new phases appear.…”

Section: Discussionmentioning

confidence: 88%

“…Various reaction product combinations were formed at the interface, that is, Ni 2 Sn 2 Zn + Cu 5 Zn 8 . The formation of thin Ni 2 Sn 2 Zn layer near the substrate enhances the joint reliability [15]. Hence, the adoption of Ni(Cu) solid solution substrate will provide an effective way to improve the joint reliability of the Sn-Zn soldering system.…”

Section: Discussionmentioning

confidence: 99%

“…Minor alloying elements are added in Sn-9Zn solder to enhance joint reliability. Most studies focused on the alloying effect on Sn-9Zn solder performance; additional elements can enhance the corrosion resistance, tensile strength, and wettability of Sn-9Zn solder [12][13][14][15][16][17]. Only limited attention was given to interfacial reaction in soldered joints.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints

Zhu

Peng

Wei

et al. 2019

Metals

View full text Add to dashboard Cite

Sn-9Zn solder is a promising Pb-free solder, but it tends to form bulky intermetallic compounds (IMC) grains at the interface when soldered with common simple metal Cu or Ni substrates. Interfacial reaction between Sn-9Zn solder and Ni(Cu) solid solution substrates at 250 °C and 350 °C were systematically probed in this study. Results showed that when soldered at 250 °C, a Ni5Zn21 layer is formed at Sn-Zn/Ni-20Cu and Sn-Zn/Ni-40Cu joints; and Ni2Sn2Zn + Cu5Zn8 and Cu5Zn8 phases are formed in Sn-Zn/Ni-60Cu and Sn-Zn/Ni-80Cu joints, respectively. Fine-grained IMCs formed at the interface are formed even when the soldered time is prolonged to 16 h. This result indicates that Ni(Cu) solid solution substrates inhibit the rapid growth of IMC at the Sn-Zn/Ni-Cu interface. Ni(Cu) solid solution substrate can also provide various combinations of reaction products at the Sn-Zn/Ni-Cu joints. The Ni5Zn21 transfers to Ni2Sn2Zn + Cu5Zn8 phases when the Cu content increased to 60%, and a bi-layered structure Ni2Sn2Zn + Cu5Zn8 IMCs was formed in Sn-Zn/Ni(Cu) joints at 350 °C regardless of the Cu content in Ni(Cu) substrate (20–80%). These results would provide an effective support in designing Sn-Zn soldering system with optimized IMC layer to improve mechanical performance.

show abstract

Section: Discussionmentioning

confidence: 88%

Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints

Zhu

Peng

Wei

et al. 2019

Metals

View full text Add to dashboard Cite

show abstract

“…The addition of trace elements may decrease the diffusion rate of IMC by lowering the activity of Cu and Su elements or blocking the diffusion path of atoms in a liquid-solid reaction state. Additionally, the mechanical strength may be improved by a composite microstructure close to the prediction of the dispersion reinforcement theory [15][16][17][18][19][20]. However, the impact of Cr addition to the commercial Sn-0.7Cu solder on the initial formation and growth of IMCs is unexplored.…”

Section: Introductionmentioning

confidence: 89%

Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

Son

Dong

Kim

et al. 2021

Metals

View full text Add to dashboard Cite

The nucleation kinetics and morphology of Cu6Sn5 IMCs at the interface between a Sn-0.7Cu-0.2Cr solder and Cu substrate were investigated in this study. A Sn-0.7Cu solder was utilized as a reference to elucidate the impact of Cr addition. The mechanical properties of the solder joints were determined via ball-shear tests. Cu coupons were dipped in the molten solders for 1 and 3 s at 240–300 °C, and the morphological analyses were conducted via electron microscopy. Both the solders contained scallop-like Cu6Sn5 IMCs. The smallest Cu6Sn5 IMCs were observed at 260 °C in both the solders, and the particle size increased at 280 and 300 °C. The IMCs in the Sn-0.7Cu-0.2Cr solder were smaller and thinner than those in the Sn-0.7Cu solder at all the reaction temperatures. The thickness of the IMCs increased as the reaction temperature increased. Inverse C-type nucleation curves were obtained, and the maximum nucleation rate was observed at an intermediate temperature. The shear strengths of the Sn-0.7Cu-0.2Cr solder joints were higher than those of the Sn-0.7Cu solder joints. This study will facilitate the application of lead-free solders, such as Sn-0.7Cu-0.2Cr, in automotive electrical components.

show abstract

“…The stability of the microstructure, which occurs during high temperature deformation, is indicated by the changing value of n with temperature, as shown in table 3. However, the variation in the n values for the five solder alloys strongly suggests that the desirable enhanced solid solution effect of Ni and the formation of dispersed strengthened IMCs, which could prevent the climbing of dislocations during the creep occurrence, are the main factors affecting the creep deformation [36,61]. Therefore, we can generally obtain and deduce from the present study and from long-term knowledge that the deformation-control mechanisms in multiphase eutectic structures or the enhanced particle strengthening of Pb-free solder alloys may coincide with those noticed and obtained in pure tin itself, but it conducts and works at a higher stress than pure Sn.…”

Section: T T Mmentioning

confidence: 99%

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO₂ nanoparticles via vacuum melting process

Mohamed,

Mostafa,

Mahmoud

et al. 2023

Phys. Scr.

View full text Add to dashboard Cite

The impact of minor additions of nickel and ZrO2 nanoparticles to eutectic Sn-9wt%Zn (SZ) prepared by vacuum melting technique was investigated. The morphologies and microstructures were carried out using an optical microscope (OM) and field emission scanning electron microscope technique (FESEM) escorted by energy dispersive x-ray spectrometry (EDX). The phase structure of the specimens was confirmed by an X-ray diffractometer (XRD). The results obtained demonstrate that small Ni addition causes a major grain refinement of β-Sn, due to the formation of the fine intermetallic compounds Ni5Zn21 and Sn3Ni4Zn3 phases and refines the formation of α- Zn lamellar phase. The melting temperature of the recently discovered solder alloys was lower than that of the eutectic Sn-Zn solders (∆Tm ~ 28 ºC) as a result of the preparation technique and the incorporation of Ni and ZrO2 nanoparticles. The tensile test showed enhanced the mechanical properties of SZ solder as a result of the addition of third elements. The experimental results showed that of all the alloys under investigation, the SZN903 alloy had the greatest UTS and YS values. The enhanced strength of the SZ-ZrO2 alloy defended the results of σUTS and increased the stress exponent parameters, n, by ∼20%. All solders had an activation energy Q that measured between ∼35.62 kJ/mol to ∼58.12 kJ/mol which comparable to the pipe-diffusion mechanism.

show abstract

Effects of Co addition on shear strength and interfacial microstructure of Sn–Zn–(Co)/Ni joints

Cited by 5 publications

References 32 publications

Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints

Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints

Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO₂ nanoparticles via vacuum melting process

Contact Info

Product

Resources

About

Effects of Co addition on shear strength and interfacial microstructure of Sn–Zn–(Co)/Ni joints

Cited by 5 publications

References 32 publications

Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints

Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints

Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO2 nanoparticles via vacuum melting process

Contact Info

Product

Resources

About

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO₂ nanoparticles via vacuum melting process